-
3
-
-
0029544419
-
Si-MOSFET scaling down to deep-0.1 micron range and future of silicon LSI
-
H. S. M. Iwai and Y. Katsumata, Si-MOSFET scaling down to deep-0.1 micron range and future of silicon LSI, in Proc. VLSITSA Tech. Papers, 1995, pp. 262-267.
-
(1995)
Proc. VLSITSA Tech. Papers
, pp. 262-267
-
-
Iwai, H.S.M.1
Katsumata, Y.2
-
4
-
-
0026400174
-
Possibilities of CMOS mainframe and its impact on technology R&D
-
Oiso, Japan
-
A. Masaki, Possibilities of CMOS mainframe and its impact on technology R&D, in Proc. Int. Symp. VLSI Technol., Dig. Tech. Papers, Oiso, Japan, 1991, pp. 4-7.
-
(1991)
Proc. Int. Symp. VLSI Technol., Dig. Tech. Papers
, pp. 4-7
-
-
Masaki, A.1
-
5
-
-
0027659198
-
Possibilities of deep-submicrometer CMOS for very-high-speed computer logic
-
Sept.
-
Possibilities of deep-submicrometer CMOS for very-high-speed computer logic, Proc. IEEE, vol. 81, no. 9, pp. 1311-1324, Sept. 1993.
-
(1993)
Proc. IEEE
, vol.81
, Issue.9
, pp. 1311-1324
-
-
-
6
-
-
0029491764
-
Trench isolation for 0.45 nm active pitch and below
-
A. H. Perera, J.-H. Lin, Y.-C. Ku, M. Azrak, B. Taylor, J. Hayden, M. Thompson, and M. Blackwell, Trench isolation for 0.45 nm active pitch and below, in Proc. 1995 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 679-682.
-
Proc. 1995 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 679-682
-
-
Perera, A.H.1
Lin, J.-H.2
Ku, Y.-C.3
Azrak, M.4
Taylor, B.5
Hayden, J.6
Thompson, M.7
Blackwell, M.8
-
7
-
-
0029720158
-
A shallow trench isolation for 0.25/0.18 μm CMOS technologies and beyond
-
Honolulu, HI
-
A. Chatterjee, J. Esquivel, S. Nag, I. Ali, D. Rodgers, K. Taylor, K. Joyner, M. Mason, D. Mercer, A. Amerasekera, T. Houston, and I.-C. Chen, A shallow trench isolation for 0.25/0.18 μm CMOS technologies and beyond, in Proc. Symp. VLSI Technol., Dig. Tech. Papers, Honolulu, HI, 1996, pp. 156-157.
-
(1996)
Proc. Symp. VLSI Technol., Dig. Tech. Papers
, pp. 156-157
-
-
Chatterjee, A.1
Esquivel, J.2
Nag, S.3
Ali, I.4
Rodgers, D.5
Taylor, K.6
Joyner, K.7
Mason, M.8
Mercer, D.9
Amerasekera, A.10
Houston, T.11
Chen, I.-C.12
-
8
-
-
85024311863
-
New technologies of KrF excimer laser lithography system in 0.25 micron complex circuit patterns
-
Kyoto, Japan
-
M. Matsuo, K. Yamashita, M. Endo, K. Hashimoto, T. Koizumi, A. Katsumata, M. Sasago, and N. Nomura, New technologies of KrF excimer laser lithography system in 0.25 micron complex circuit patterns, in Proc. Symp. VLSI Technol., Dig. Tech. Papers, Kyoto, Japan, 1993, pp'. 145-146.
-
(1993)
Proc. Symp. VLSI Technol., Dig. Tech. Papers
, pp. 145-146
-
-
Matsuo, M.1
Yamashita, K.2
Endo, M.3
Hashimoto, K.4
Koizumi, T.5
Katsumata, A.6
Sasago, M.7
Nomura, N.8
-
9
-
-
84957329185
-
0.13 μm pattern delineation using KrF excimer laser light
-
Dec.
-
A. Imai, N. Asai, T. Uenoi, N. Hasegawa, T. Tanaka, T. Terawsawa, and S. Okazaki, 0.13 μm pattern delineation using KrF excimer laser light, Jap. J. Appl. Ph\s., vol. 33, pt. 1, no. 12B, pp. 6816-6822, Dec. 1994.
-
(1994)
Jap. J. Appl. Ph\s.
, vol.33
, Issue.PT. 1 NO. 12B
, pp. 6816-6822
-
-
Imai, A.1
Asai, N.2
Uenoi, T.3
Hasegawa, N.4
Tanaka, T.5
Terawsawa, T.6
Okazaki, S.7
-
10
-
-
0019049847
-
Design and characterization of the lightly doped drain (LDD) insulated gate field effect transistor
-
S. Ogura, P. Tsang, W. Walker, D. Critchlow, and J. Shepard, Design and characterization of the lightly doped drain (LDD) insulated gate field effect transistor, IEEE Trans. Electron Devices, vol. ED-27, no. 8, pp. 1359-1367, 1980
-
(1980)
IEEE Trans. Electron Devices
, vol.ED-27
, Issue.8
, pp. 1359-1367
-
-
Ogura, S.1
Tsang, P.2
Walker, W.3
Critchlow, D.4
Shepard, J.5
-
11
-
-
0018456839
-
Hot-electron emission in n-channel IGFET's
-
P. E. Coltrel, R. R. Troutman, and T. H. Ning, Hot-electron emission in n-channel IGFET's, IEEE Trans. Electron Devices vol. ED-26, pp. 520-533, 1979.
-
(1979)
IEEE Trans. Electron Devices
, vol.ED-26
, pp. 520-533
-
-
Coltrel, P.E.1
Troutman, R.R.2
Ning, T.H.3
-
12
-
-
0019476903
-
Threshold voltage instability in MOSFET's due to channel hot-hole emission
-
R. B. Fair and R. C. Sun, Threshold voltage instability in MOSFET's due to channel hot-hole emission, IEEE Trans Electron Devices, vol. ED-28, pp. 83-93, 1981.
-
(1981)
IEEE Trans Electron Devices
, vol.ED-28
, pp. 83-93
-
-
Fair, R.B.1
Sun, R.C.2
-
13
-
-
0027594080
-
VLSI reliability challenges: From device physics to wafer scale systems
-
May
-
E. Takeda, K. Ikuzaki, H. Katto, Y. Ohji, H. Hinode, A. Hamada, T. Sakuta, T. Funabashi, and T. Sasaki, VLSI reliability challenges: From device physics to wafer scale systems, Proc. IEEE. vol. 81, no. 5, pp. 653-674, May 1993.
-
(1993)
Proc. IEEE.
, vol.81
, Issue.5
, pp. 653-674
-
-
Takeda, E.1
Ikuzaki, K.2
Katto, H.3
Ohji, Y.4
Hinode, H.5
Hamada, A.6
Sakuta, T.7
Funabashi, T.8
Sasaki, T.9
-
14
-
-
0029545617
-
Reverse short-channel effect and channel length dependence of boron penetration in PMOSFET's
-
C. Subramanian, J. Hayden, W. Taylor, M. Orlowski, and T. McNelly, Reverse short-channel effect and channel length dependence of boron penetration in PMOSFET's, in Proc. 1995 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 423-426.
-
Proc. 1995 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, .
, pp. 423-426
-
-
Subramanian, C.1
Hayden, J.2
Taylor, W.3
Orlowski, M.4
McNelly, T.5
-
15
-
-
0029514097
-
A 0.25 /im CMOS technology with 45 A NO-nitrided oxide
-
M. Luo, P. Tsui, W.-M. Chen, P. Gilbert, B. Maiti, A. Sitaram, and S.-W. Sun, A 0.25 /im CMOS technology with 45 A NO-nitrided oxide, in P roc. 1995 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 691-694.
-
P Roc. 1995 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 691-694
-
-
Luo, M.1
Tsui, P.2
Chen, W.-M.3
Gilbert, P.4
Maiti, B.5
Sitaram, A.6
Sun, S.-W.7
-
16
-
-
20244380605
-
The impact of nitrogen profile engineering on ultrathin nitrided oxide films for dual-gate CMOS LSI
-
E. Hasagawa, M. Kawata, K. Ando, M. Makabe, M. Kitakata, A. Ishitani, L. Manchanda, M. L. Green, K. S. Krisch, and L. C. Feldman, The impact of nitrogen profile engineering on ultrathin nitrided oxide films for dual-gate CMOS LSI, in Proc. 1995 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 327-380.
-
Proc. 1995 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 327-380
-
-
Hasagawa, E.1
Kawata, M.2
Ando, K.3
Makabe, M.4
Kitakata, M.5
Ishitani, A.6
Manchanda, L.7
Green, M.L.8
Krisch, K.S.9
Feldman, L.C.10
-
17
-
-
0029545395
-
2O gate oxynitrides for low-voltage operation of dual-gate CMOSFET's
-
2O gate oxynitrides for low-voltage operation of dual-gate CMOSFET's, in Proc. 1995 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 851-854.
-
Proc. 1995 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 851-854
-
-
Matsuoka, T.1
Kakimoto, S.2
Nakano, M.3
Kotaki, H.4
Hayashida, S.5
Sugimoto, K.6
Adachi, K.7
Morishita, S.8
Uda, K.9
Sato, Y.10
Yamanaka, M.11
Ogura, T.12
Takagi, J.13
-
18
-
-
0029713414
-
Novel salicide technology using Ti hydrogenation for 0.1-μm CMOS
-
Honolulu
-
K. Ando, Y. Matsubara, T. Ishigami, T. Horiuchi, and S. Nishimoto, Novel salicide technology using Ti hydrogenation for 0.1-μm CMOS, in Proc. Symp. VLSI Technol., Dig. Tech. Papers, Honolulu, 1996, pp. 16-17.
-
(1996)
Proc. Symp. VLSI Technol., Dig. Tech. Papers
, pp. 16-17
-
-
Ando, K.1
Matsubara, Y.2
Ishigami, T.3
Horiuchi, T.4
Nishimoto, S.5
-
19
-
-
0029520356
-
A new cobalt salicide technology for 0.15 μm CMOS using high-temperature and in situ vacuum annealing
-
K. Inoue, K. Mikagi, H. Abiko, and T. Kikkawa, A new cobalt salicide technology for 0.15 μm CMOS using high-temperature and in situ vacuum annealing, in Proc. 1995 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 445-448.
-
Proc. 1995 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 445-448
-
-
Inoue, K.1
Mikagi, K.2
Abiko, H.3
Kikkawa, T.4
-
20
-
-
0029516375
-
Leakage mechanism and optimized Co salicide process for deep submicron CMOS process
-
K. Goto, A. Fushida, J. Watanabe, T. Sukegawa, K. Kawamura, T. Yamazaki, and T. Sugii, Leakage mechanism and optimized Co salicide process for deep submicron CMOS process, in Proc. 1995 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 449-452.
-
Proc. 1995 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 449-452
-
-
Goto, K.1
Fushida, A.2
Watanabe, J.3
Sukegawa, T.4
Kawamura, K.5
Yamazaki, T.6
Sugii, T.7
-
21
-
-
0029490218
-
Nitrogen-doped nickel monosilicide technique for deep submicron CMOS salicide
-
T. Ohguro, S. Namkamura, E. Morifuji, M. Ono, T. Yoshitomi, M. Saito, H. Momose, and H. Iwai, Nitrogen-doped nickel monosilicide technique for deep submicron CMOS salicide, in Proc. 1995 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 453-456.
-
Proc. 1995 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 453-456
-
-
Ohguro, T.1
Namkamura, S.2
Morifuji, E.3
Ono, M.4
Yoshitomi, T.5
Saito, M.6
Momose, H.7
Iwai, H.8
-
22
-
-
0023592415
-
Submicron wiring technology with tungsten and planarization
-
C. Kaanta, W. Cote, J. Cronin, K. Holland, P. Lee, and T. Wright, Submicron wiring technology with tungsten and planarization, in Proc. 1987 IEEE Int. Electron Devices Meet, Dig. Tech. Papers., pp. 209-212.
-
Proc. 1987 IEEE Int. Electron Devices Meet, Dig. Tech. Papers.
, pp. 209-212
-
-
Kaanta, C.1
Cote, W.2
Cronin, J.3
Holland, K.4
Lee, P.5
Wright, T.6
-
23
-
-
0028565182
-
Sub-quarter micron copper interconnects through dry etching process and its reliability
-
Honolulu
-
S. Igarashi, T. Yamanobe, H. Jinbo, and T. Ito, Sub-quarter micron copper interconnects through dry etching process and its reliability, in Proc. Symp. VLSI Technol., Dig. Tech. Papers, Honolulu, 1994, pp. 57-58.
-
(1994)
Proc. Symp. VLSI Technol., Dig. Tech. Papers
, pp. 57-58
-
-
Igarashi, S.1
Yamanobe, T.2
Jinbo, H.3
Ito, T.4
-
24
-
-
0030398615
-
Barrier metal free copper damascene interconnection technology using atmospheric copper reflow and nitrogen doping in SiOF film
-
K. Mikagi, H. Ishikawa, T. Usami, M. Suzuki, K. Inoue, N. Oda, S. Chikaki, I. Salkai, and T. Kikkawa, Barrier metal free copper damascene interconnection technology using atmospheric copper reflow and nitrogen doping in SiOF film, in Proc. 1996 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 365-368.
-
Proc. 1996 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 365-368
-
-
Mikagi, K.1
Ishikawa, H.2
Usami, T.3
Suzuki, M.4
Inoue, K.5
Oda, N.6
Chikaki, S.7
Salkai, I.8
Kikkawa, T.9
-
25
-
-
0347399086
-
Dielectric barrier study for Cu metallization
-
C. Chiang, S. Tzeng, G. Raghavan, R. Villasol, G. Bai, M. Bohr, H. Fujimoto, and D. Fraser, Dielectric barrier study for Cu metallization, in Proc. VLSI Multilevel Interconnection Conf., 1994, pp. 414-420.
-
(1994)
Proc. VLSI Multilevel Interconnection Conf.
, pp. 414-420
-
-
Chiang, C.1
Tzeng, S.2
Raghavan, G.3
Villasol, R.4
Bai, G.5
Bohr, M.6
Fujimoto, H.7
Fraser, D.8
-
26
-
-
0029703316
-
3 dielectric and Pt electrodes for 1 Gigabit density DRAM
-
Honolulu, HI
-
3 dielectric and Pt electrodes for 1 Gigabit density DRAM, in Proc. Symp. VLSI Technol., Dig. Tech. Papers Honolulu, HI, 1996, pp. 24-25.
-
(1996)
Proc. Symp. VLSI Technol., Dig. Tech. Papers
, pp. 24-25
-
-
Park, S.1
Hwang, C.2
Kang, C.3
Cho, H.4
Lee, B.5
Lee, S.6
Lee, M.7
-
27
-
-
0029714790
-
cc/2-plate nonvolatile DRAM cell with a Pt/PZT/Pt/fiN capacitor patterned by onemask dry etching
-
Honolulu, HI
-
cc/2-plate nonvolatile DRAM cell with a Pt/PZT/Pt/fiN capacitor patterned by onemask dry etching, in Proc. Symp. VLSI Technol., Dig. Tech. Papers, Honolulu, HI, 1996, pp. 28-29.
-
(1996)
Proc. Symp. VLSI Technol., Dig. Tech. Papers
, pp. 28-29
-
-
Shoji, K.1
Moniwa, M.2
Yamashita, H.3
Kisu, T.4
Kaga, T.5
Torii, K.6
Kumihashi, T.7
Morimoto, T.8
Kawakami, H.9
Gotoh, Y.10
Itoga, T.11
Tanaka, T.12
Yokoyama, N.13
Kure, T.14
Ohkura, M.15
Fujisaki, Y.16
Sakata, K.17
Kimura, K.18
-
28
-
-
0030383557
-
Trench storage node technology for gigabit DRAM generations
-
K. Muller, B. Flietner, C. Hwang, R. Kleinhenz, T. Nakao, R. Ranade, Y. Tsunashima, and T. Mii, Trench storage node technology for gigabit DRAM generations, in Proc. 1996 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 507-510.
-
Proc. 1996 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 507-510
-
-
Muller, K.1
Flietner, B.2
Hwang, C.3
Kleinhenz, R.4
Nakao, T.5
Ranade, R.6
Tsunashima, Y.7
Mii, T.8
-
29
-
-
0018331014
-
Alpha-particle-induced soft errors in dynamic memories
-
T. C. May and M. Woods, Alpha-particle-induced soft errors in dynamic memories, IEEE Trans. Electron Devices, vol. ED-26, pp. 2-9, 1979.
-
(1979)
IEEE Trans. Electron Devices
, vol.ED-26
, pp. 2-9
-
-
May, T.C.1
Woods, M.2
-
30
-
-
0025449455
-
Trends in megabit DRAM circuit design
-
June
-
K. Itoh, Trends in megabit DRAM circuit design, IEEE J. Solid-State Circuits, vol. 25, pp. 778-789, June 1990.
-
(1990)
IEEE J. Solid-State Circuits
, vol.25
, pp. 778-789
-
-
Itoh, K.1
-
31
-
-
0029288557
-
Trends in low-power RAM circuit technologies
-
Apr.
-
K. Itoh, K. Sasaki, and Y. Nakagome, Trends in low-power RAM circuit technologies, Proc. IEEE, vol. 83, no. 4, pp. 524-543, Apr. 1995.
-
(1995)
Proc. IEEE
, vol.83
, Issue.4 NO
, pp. 524-543
-
-
Itoh, K.1
Sasaki, K.2
Nakagome, Y.3
-
32
-
-
33646923218
-
Carrier mobility and current saturation in the MOS transistor
-
S. R. Hofstein and G. Warfield, Carrier mobility and current saturation in the MOS transistor, IEEE Trans. Electron Devices, vol. ED-12, pp. 129-138, 1965.
-
(1965)
IEEE Trans. Electron Devices
, vol.ED-12
, pp. 129-138
-
-
Hofstein, S.R.1
Warfield, G.2
-
33
-
-
0015330654
-
Ion-implanted complementary MOS transistors in low-voltage circuits
-
Apr.
-
R. Swanson and J. Meindl, Ion-implanted complementary MOS transistors in low-voltage circuits, IEEE J. Solid-State Circuits, vol. SC-7, pp. 146-153, Apr. 1972.
-
(1972)
IEEE J. Solid-State Circuits, .
, vol.SC-7
, pp. 146-153
-
-
Swanson, R.1
Meindl, J.2
-
34
-
-
0020557616
-
A new short-channel MOSFET with an atomic-layer-doping impurity profile (ALD-MOSFET)
-
K. Yamaguchi, Y. Shiraki, Y. Katayama,- and Y. Murayama, A new short-channel MOSFET with an atomic-layer-doping impurity profile (ALD-MOSFET), Jap. J. Appl. Phys., vol. 22, pp. 267-270, 1983.
-
(1983)
Jap. J. Appl. Phys.
, vol.22
, pp. 267-270
-
-
Yamaguchi, K.1
Shiraki, Y.2
Katayama, Y.3
Murayama, Y.4
-
35
-
-
0028599189
-
0.1 μm delta-doped MOSFET using post low-energy implanting selective epitaxy
-
Honolulu, HI
-
K. Noda, T. Uchida, T. Tatsumi, T. Aoyama, K. Nakajima, H. Miyamoto, T. Hashimoto, and I. Sasaki, 0.1 μm delta-doped MOSFET using post low-energy implanting selective epitaxy, in Proc. Symp. VLSI Technol., Dig. Tech. Papers, Honolulu, HI, 1994, pp. 19-20.
-
Proc. Symp. VLSI Technol., Dig. Tech. Papers
, vol.1994
, pp. 19-20
-
-
Noda, K.1
Uchida, T.2
Tatsumi, T.3
Aoyama, T.4
Nakajima, K.5
Miyamoto, H.6
Hashimoto, T.7
Sasaki, I.8
-
36
-
-
0028736932
-
A 0.05 μm CMOS with ultra shallow source/drain junctions fabricated by 5 keV ion implantation and rapid thermal annealing
-
A. Hori, H. Nakaoka, H. Umimoto, K. Yamashita, M. Takase, N. Shimizu, B. Mizuno, and S. Odanaka, A 0.05 μm CMOS with ultra shallow source/drain junctions fabricated by 5 keV ion implantation and rapid thermal annealing, in Proc. 1994 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 485-488.
-
Proc. 1994 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 485-488
-
-
Hori, A.1
Nakaoka, H.2
Umimoto, H.3
Yamashita, K.4
Takase, M.5
Shimizu, N.6
Mizuno, B.7
Odanaka, S.8
-
38
-
-
33746189368
-
0.1 μm-gate, ultra-thin CMOS devices using SIMOX substrate with 80 nm-thick buried oxide layer
-
Y. Omura, S. Nakashima, K. Izumi, and T. Ishii, 0.1 μm-gate, ultra-thin CMOS devices using SIMOX substrate with 80 nm-thick buried oxide layer, in Proc. 1991 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 675-678.
-
Proc. 1991 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 675-678
-
-
Omura, Y.1
Nakashima, S.2
Izumi, K.3
Ishii, T.4
-
39
-
-
0028746226
-
Tradeoffs of current drive versus short-channel effect in deep-submicrometer bulk and SOI MOSFET's
-
L. Su, H. Hu, J. Jacobs, M. Sherony, A. Wei, and D. Antoniadis, Tradeoffs of current drive versus short-channel effect in deep-submicrometer bulk and SOI MOSFET's, in Proc. 1994 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 649-652.
-
Proc.
, vol.1994
, pp. 649-652
-
-
Su, L.1
Hu, H.2
Jacobs, J.3
Sherony, M.4
Wei, A.5
Antoniadis, D.6
-
41
-
-
0028532218
-
+ double-gate SOI MOSFET's
-
Oct.
-
+ double-gate SOI MOSFET's, IEEE Electron Device Lett., vol. 15, no. 10, pp. 386-388, Oct. 1994.
-
(1994)
IEEE Electron Device Lett.
, vol.15
, Issue.10 NO
, pp. 386-388
-
-
Tanaka, T.1
Suzuki, K.2
Horie, H.3
Sugii, T.4
-
42
-
-
0030271147
-
A comparative study of advanced MOSFET concept
-
C. Wann, K. Noda, T. Tanaka, M. Yoshida, and C. Hu, A comparative study of advanced MOSFET concept, IEEE Trans. Electron Devices, vol. 43, pp. 1742-1753, 1996.
-
(1996)
IEEE Trans. Electron Devices
, vol.43
, pp. 1742-1753
-
-
Wann, C.1
Noda, K.2
Tanaka, T.3
Yoshida, M.4
Hu, C.5
-
44
-
-
17044457645
-
A double layer metal CHMOS III technology
-
R. J. Smith, G. Sery, J. McCollum, J. Orton, B. Mantha, J. Smudski, T. Chi, S. Smith, J. Dishaw, and K. Kokkonen, A double layer metal CHMOS III technology, in Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 56-58.
-
Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 56-58
-
-
Smith, R.J.1
Sery, G.2
McCollum, J.3
Orton, J.4
Mantha, B.5
Smudski, J.6
Chi, T.7
Smith, S.8
Dishaw, J.9
Kokkonen, K.10
-
45
-
-
0021640146
-
Hi-CMOS III technology
-
S. Meguro, S. Ikeda, K. Nagasawa, A. Koike, and T. Yasui, Hi-CMOS III technology, in Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 59-62.
-
Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 59-62
-
-
Meguro, S.1
Ikeda, S.2
Nagasawa, K.3
Koike, A.4
Yasui, T.5
-
46
-
-
0028754969
-
A high-performance 0.35 μm logic technology for 3.3 V and 2.5 V operation
-
M. Bohr, S. U. Ahmed, L. Brigham, R. Chau, R. Gasse, R. Green, W. Hargrove, E. Lee, R. Natter, S. Thompson, K. Weldon, and S. Yang, A high-performance 0.35 μm logic technology for 3.3 V and 2.5 V operation, in Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 273-276.
-
Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 273-276
-
-
Bohr, M.1
Ahmed, S.U.2
Brigham, L.3
Chau, R.4
Gasse, R.5
Green, R.6
Hargrove, W.7
Lee, E.8
Natter, R.9
Thompson, S.10
Weldon, K.11
Yang, S.12
-
47
-
-
0028748019
-
A study of design/process dependence of 0.25 μm gate length CMOS for improved performance and reliability
-
M. Rodder, A. Amerasekera, S. Aur, and I.-C. Chen, A study of design/process dependence of 0.25 μm gate length CMOS for improved performance and reliability, in Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 71-74.
-
Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 71-74
-
-
Rodder, M.1
Amerasekera, A.2
Aur, S.3
Chen, I.-C.4
-
48
-
-
0030383519
-
A high-performance 0.25 μm logic technology optimized for 1.8 V operation
-
M. Bohr, S. S. Ahmed, S. U. Ahmed, M. Bost, T. Ghani, J. Greason, R. Hainsey, C. Jan, P. Packan, S. Sivakumar, S. Thompson, J. Tsai, and S. Yang, A high-performance 0.25 μm logic technology optimized for 1.8 V operation, in Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 847-850.
-
Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 847-850
-
-
Bohr, M.1
Ahmed, S.S.2
Ahmed, S.U.3
Bost, M.4
Ghani, T.5
Greason, J.6
Hainsey, R.7
Jan, C.8
Packan, P.9
Sivakumar, S.10
Thompson, S.11
Tsai, J.12
Yang, S.13
-
49
-
-
0030387333
-
A sub-0.18 μm gate length CMOS technology for high-performance (1.5 V) and low power (1.0 V)
-
M. Rodder, Q. Z. Hong, M. Nandakumar, S. Aur, J. C. Hu, and I.-C. Chen, A sub-0.18 μm gate length CMOS technology for high-performance (1.5 V) and low power (1.0 V), in Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 563-566.
-
Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 563-566
-
-
Rodder, M.1
Hong, Q.Z.2
Nandakumar, M.3
Aur, S.4
Hu, J.C.5
Chen, I.-C.6
-
50
-
-
0028736933
-
0.15 /im CMOS process for high performance and high reliability
-
S. Shimizu, T. Kuroi, M. Kobayashi, T. Yamaguchi, T. Fujino, I H. Maeda, T. Tsutsumi, Y. Hirose, S. Kusunoki, M. Inuishi, and N. Tsubouchi, 0.15 /im CMOS process for high performance and high reliability, in Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 67-70.
-
Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 67-70
-
-
Shimizu, S.1
Kuroi, T.2
Kobayashi, M.3
Yamaguchi, T.4
Fujino, T.5
Maeda, I.H.6
Tsutsumi, T.7
Hirose, Y.8
Kusunoki, S.9
Inuishi, M.10
Tsubouchi, N.11
-
51
-
-
0029713063
-
A high-performance 0.08 /im CMOS
-
L. Su, S. Subbanna, E. Crabbe, P. Agnello, E. Novak, R. Schulz, S. Rauch, H. Ng, T. Newman, A. Ray, M. Hargrove, A. Acovic, J. Snare, S. Crowder, B. Chen, J. Sun, and B. Davari, A high-performance 0.08 /im CMOS, in Proc. 1996 Int. Symp. VLSI Technol., Dig. Tech. Papers, pp. 12-13.
-
Proc. 1996 Int. Symp. VLSI Technol., Dig. Tech. Papers
, pp. 12-13
-
-
Su, L.1
Subbanna, S.2
Crabbe, E.3
Agnello, P.4
Novak, E.5
Schulz, R.6
Rauch, S.7
Ng, H.8
Newman, T.9
Ray, A.10
Hargrove, M.11
Acovic, A.12
Snare, J.13
Crowder, S.14
Chen, B.15
Sun, J.16
Davari, B.17
-
52
-
-
0030393799
-
Supression of delay time instability on frequency using field shield isolation technology for deep submicron SOI circuits, in
-
S. Maeda, Y. Yamaguchi, I.-J. Kim, T. Iwamatsu, T. Ipposhi, S. Miyamoto, S. Maegawa, K. Ueda, K. Nil, K. Mashiko, Y. Inoue, and H. Miyoshi, Supression of delay time instability on frequency using field shield isolation technology for deep submicron SOI circuits, in Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 129-132.
-
Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 129-132
-
-
Maeda, S.1
Yamaguchi, Y.2
Kim, I.-J.3
Iwamatsu, T.4
Ipposhi, T.5
Miyamoto, S.6
Maegawa, S.7
Ueda, K.8
Nil, K.9
Mashiko, K.10
Inoue, Y.11
Miyoshi, H.12
-
53
-
-
0029547931
-
SOI MOSFET design for all-dimensional scaling with short channel, narrow width, and ultra-thin films
-
M. Chan, S. K. H. Fung, K. Y. Hui, C. Hu, and P. K. Ko, SOI MOSFET design for all-dimensional scaling with short channel, narrow width, and ultra-thin films, in Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 631-634.
-
Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 631-634
-
-
Chan, M.1
Fung, S.K.H.2
Hui, K.Y.3
Hu, C.4
Ko, P.K.5
-
54
-
-
0025212768
-
A fully-depleted lean-channel transistor (DELTA)-A novel vertical ultrathin SOI MOSFET
-
Jan.
-
D. Hisamoto, T. Kaga, Y. Kawamoto, and E. Takeda, A fully-depleted lean-channel transistor (DELTA)-A novel vertical ultrathin SOI MOSFET, IEEE Electron Device Lett., vol. 11, pp. 36-38, Jan. 1990.
-
(1990)
IEEE Electron Device Lett.
, vol.11
, pp. 36-38
-
-
Hisamoto, D.1
Kaga, T.2
Kawamoto, Y.3
Takeda, E.4
-
55
-
-
33746189368
-
0.1 μm-gate, ultrathin-film CMOS devices using SIMOX substrate with 80-nm-thick buried oxide layer
-
Y. Omura, S. Nakashima, K. Izumi, and T. Ishii, 0.1 μm-gate, ultrathin-film CMOS devices using SIMOX substrate with 80-nm-thick buried oxide layer, in Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 675-678.
-
Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 675-678
-
-
Omura, Y.1
Nakashima, S.2
Izumi, K.3
Ishii, T.4
-
56
-
-
0030407070
-
High-frequency ac characteristics of 1.5 nm gate oxide MOSFET's
-
H. Momose, E. Morifuji, T. Yoshitomi, T. Ohguro, M. Saito, T. Morimoto, Y. Katsumata, and H. Iwai, High-frequency ac characteristics of 1.5 nm gate oxide MOSFET's, in Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 105-109.
-
Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 105-109
-
-
Momose, H.1
Morifuji, E.2
Yoshitomi, T.3
Ohguro, T.4
Saito, M.5
Morimoto, T.6
Katsumata, Y.7
Iwai, H.8
-
57
-
-
33646934154
-
Performance and reliability concerns of ultra-thin gate MOSFET's
-
A. Toriumi, J, Koga, H. Satake, and A. Ohata, Performance and reliability concerns of ultra-thin gate MOSFET's, in Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 847-850.
-
Proc. 1984 IEEE Int. Electron Devices Meet., Dig. Tech. Papers
, pp. 847-850
-
-
Toriumi, A.1
Satake, H.2
Ohata, A.3
-
59
-
-
0029723460
-
Suppression of the SOI floating body effects by linked-body device structure
-
W. Chen, Y. Taur, D. Sadana, K. Jenkins, J. Sun, and S. Cohen, Suppression of the SOI floating body effects by linked-body device structure, in Proc. Symp. VLSI Technol. Dig. Tech. Papers, Honolulu, HI, 1996, pp. 92-93.
-
(1996)
Proc. Symp. VLSI Technol. Dig. Tech. Papers, Honolulu, HI
, pp. 92-93
-
-
Chen, W.1
Taur, Y.2
Sadana, D.3
Jenkins, K.4
Sun, J.5
Cohen, S.6
-
60
-
-
0016116644
-
Design of ion-implanted MOSFET's with very small physical dimensions
-
May
-
R. Dennard, F. Gaensslen, H. Yu, L. Rideout, E. Bassous, and A. LeBlanc, Design of ion-implanted MOSFET's with very small physical dimensions, IEEE J. Solid-State Circuits, vol. SC-9, pp. 256-268, May 1974.
-
(1974)
IEEE J. Solid-State Circuits
, vol.SC-9
, pp. 256-268
-
-
Dennard, R.1
Gaensslen, F.2
Yu, H.3
Rideout, L.4
Bassous, E.5
Leblanc, A.6
-
61
-
-
0025464151
-
Projecting gate oxide reliability and optimizing burn-in
-
R. Mozzami and C. Hu, Projecting gate oxide reliability and optimizing burn-in, IEEE Trans. Electron Devices, vol. 37, pp. 1643-1650, 1990.
-
(1990)
IEEE Trans. Electron Devices
, vol.37
, pp. 1643-1650
-
-
Mozzami, R.1
Hu, C.2
-
62
-
-
0021515560
-
Hot-carrier effects in sub-micrometer MOS VLSI's
-
May
-
E. Takeda, Hot-carrier effects in sub-micrometer MOS VLSI's, lEEProc., vol. 131, no. 5, p. 153, May 1985.
-
(1985)
LEEProc.
, vol.131
, Issue.5 NO
, pp. 153
-
-
Takeda, E.1
-
63
-
-
84945713471
-
Hot-electron induced MOSFET degradation-Model, monitor, improvement
-
Feb.
-
C. Hu, S. Tarn, F. Hsu, P. Ko, T. Chan, and K. Kyle, Hot-electron induced MOSFET degradation-Model, monitor, improvement, IEEE Trans. Electron Devices, vol. ED-32, pp. 375-385, Feb. 1985.
-
(1985)
IEEE Trans. Electron Devices
, vol.ED-32
, pp. 375-385
-
-
Hu, C.1
Tarn, S.2
Hsu, F.3
Ko, P.4
Chan, T.5
Kyle, K.6
-
64
-
-
0017945931
-
Evaluation of arsenic implanted layers by means of MOS memory characteristics
-
Y. Wada, S. Nishimatsuand, and K. Sato, Evaluation of arsenic implanted layers by means of MOS memory characteristics, Solid-State Electron., vol. 21, pp. 513-518, 1978.
-
(1978)
Solid-State Electron.
, vol.21
, pp. 513-518
-
-
Wada, Y.1
Nishimatsuand, S.2
Sato, K.3
-
65
-
-
0026852625
-
A high performance 0.25 μm CMOS technology: Il-technology
-
B. Davari, W. H. Chang, K. E. Petrillo, C. Y. Wona, D. Moy, Y. Taur, M. R. Wordeman, J. Y.-C. Sun, C. C.-H. Hsu, and M. R. Polcari, A high performance 0.25 μm CMOS technology: Il-technology, IEEE Trans. Electron Devices, vol. 39, pp. 967-975, 1992.
-
(1992)
IEEE Trans. Electron Devices
, vol.39
, pp. 967-975
-
-
Davari, B.1
Chang, W.H.2
Petrillo, K.E.3
Wona, C.Y.4
Moy, D.5
Taur, Y.6
Wordeman, M.R.7
Sun, J.Y.-C.8
Hsu, C.C.-H.9
Polcari, M.R.10
-
66
-
-
0028747637
-
WAVNx/poly-Si gate technology for future high speed deep submicron CMOS LSI's, in
-
K. Kasai, Y. Akasaka, K. Nakajima, S. Suehiro, K. Suguro, H. Oyamatsu, M. Kinugawa, and M. Kakumu, WAVNx/poly-Si gate technology for future high speed deep submicron CMOS LSI's, in Proc. 1994 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 497-500.
-
Proc.
-
-
Kasai, K.1
Akasaka, Y.2
Nakajima, K.3
Suehiro, S.4
Suguro, K.5
Oyamatsu, H.6
Kinugawa, M.7
Kakumu, M.8
-
67
-
-
0026852069
-
A high performance 0.25 μm CMOS technology: I-design and characterization
-
W. H. Chang, B. Davari, M. R. Wordeman, Y. Taur, C. C.H. Hsu, and M. D. Rodrigucz, A high performance 0.25 μm CMOS technology: I-design and characterization, IEEE Trans. Electron Devices, vol. 39, p. 959, 1992.
-
(1992)
IEEE Trans. Electron Devices
, vol.39
, pp. 959
-
-
Chang, W.H.1
Davari, B.2
Wordeman, M.R.3
Taur, Y.4
Hsu, C.C.H.5
Rodrigucz, M.D.6
-
68
-
-
0028743978
-
Dynanic performance and leakage current characteristics of 1/4-micron-gate ultra-thin CMOS/SIMOX gate array, in
-
Y. Kado, T. Ohno, Y. Sakakibara, Y. Kawai, E. Yamamoto, A. Ohtaka, and T. Tsuchiya, Dynanic performance and leakage current characteristics of 1/4-micron-gate ultra-thin CMOS/SIMOX gate array, in Proc. 1994 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 665-668.
-
Proc.
-
-
Kado, Y.1
Ohno, T.2
Sakakibara, Y.3
Kawai, Y.4
Yamamoto, E.5
Ohtaka, A.6
Tsuchiya, T.7
-
69
-
-
0029521766
-
A scaled 1.8 V, 0.18 μm gate length CMOS technology: Device design and reliability considerations, in
-
M. Rodder, S. Aur, and I.-C. Chen, A scaled 1.8 V, 0.18 μm gate length CMOS technology: Device design and reliability considerations, in Proc. 1994 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 415-418.
-
Proc.
-
-
Rodder, M.1
Aur, S.2
Chen, I.-C.3
-
70
-
-
0030398075
-
A novel 0.15 μm CMOS technology using W/WNx/polysilicon gate electrode and Ti suicide source/drain diffusions, in
-
M. T. Takagi, K. Miyashita, H. Koyama, K. Nakajima, K. Miyano, Y. Akasaka, Y. Hiura, S. Inaba, A. Azuma, H. Koike, H. Yoshimura, K. Suguro, and H. Ishiuchi, A novel 0.15 μm CMOS technology using W/WNx/polysilicon gate electrode and Ti suicide source/drain diffusions, in Proc. 1994 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 455-458.
-
Proc.
-
-
Takagi, M.T.1
Miyashita, K.2
Koyama, H.3
Nakajima, K.4
Miyano, K.5
Akasaka, Y.6
Hiura, Y.7
Inaba, S.8
Azuma, A.9
Koike, H.10
Yoshimura, H.11
Suguro, K.12
Ishiuchi, H.13
-
71
-
-
0030387118
-
Gate oxide scaling limits and projection, in
-
C. Hu, Gate oxide scaling limits and projection, in Proc. 1994 IEEE Int. Electron Devices Meet., Dig. Tech. Papers, pp. 319-322.
-
Proc.
-
-
Hu, C.1
-
72
-
-
0030212001
-
1.5 nm direct tunneling gate oxide Si MOSFET's
-
H. Momose, M. Ono, T. Yoshitomi, T. Ohguro, S. Nakamura, M. Saito, and H. Iwai, 1.5 nm direct tunneling gate oxide Si MOSFET's, IEEE Trans. Electron Devices, vol. 43, pp. 1233-1239, Aug. 1996.
-
(1996)
IEEE Trans. Electron Devices
, vol.43
, pp. 1233-1239
-
-
Momose, H.1
Ono, M.2
Yoshitomi, T.3
Ohguro, T.4
Nakamura, S.5
Saito, M.6
Iwai, H.7
-
73
-
-
0027594079
-
Future CMOS scaling and reliability
-
C. Hu, Future CMOS scaling and reliability, Proc. IEEE, vol. 83, no. 4, pp. 682-689, Apr. 1995.
-
(1995)
Proc. IEEE
, vol.83
, Issue.4
, pp. 682-689
-
-
Hu, C.1
-
74
-
-
0029292445
-
CMOS scaling for high-performance and low power - The next ten years
-
B. Davari, R. Dennard, and G. Shahidi, CMOS scaling for high-performance and low power - The next ten years, Proc. IEEE, vol. 83, no. 4, pp. 595-606, Apr. 1995.
-
(1995)
Proc. IEEE
, vol.83
, Issue.4
, pp. 595-606
-
-
Davari, B.1
Dennard, R.2
Shahidi, G.3
-
75
-
-
33646941060
-
CMOS scaling, 0.1
-
B. Davari, CMOS scaling, 0.1 urn CMOS and beyond, in Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers. pp. 555-558.
-
Urn CMOS and Beyond, in Proc.
-
-
Davari, B.1
-
76
-
-
84936896260
-
0.1 μm CMOS and beyond, in
-
Y. Taur and Y.-J. Mii, 0.1 μm CMOS and beyond, in Proc. 1993 Int. Symp. VLSITSA, Taipei, 1993, pp. 1-5.
-
Proc.
, vol.1993
, pp. 1-5
-
-
Taur, Y.1
Mii, Y.-J.2
-
77
-
-
33646914461
-
Reducing operating voltage from 3, 2, to 1 volt and below-Challenges and guidelines for possible solutions, in
-
R.-H. Yan, D. Monroc, J. Weiss, A. Mujtaba, and E. Westerwick, Reducing operating voltage from 3, 2, to 1 volt and below-Challenges and guidelines for possible solutions, in Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers, pp. 55-58.
-
Proc.
-
-
Yan, R.-H.1
Monroc, D.2
Weiss, J.3
Mujtaba, A.4
Westerwick, E.5
-
78
-
-
0029292398
-
Low power microelectronics: Retrospect and prospect
-
J. Meindl, Low power microelectronics: Retrospect and prospect, Proc. IEEE, vol. 83, no. 4, pp. 619-635, Apr. 1995.
-
(1995)
Proc. IEEE
, vol.83
, Issue.4
, pp. 619-635
-
-
Meindl, J.1
-
79
-
-
0028745562
-
A dynamic threshold voltage MOSFET (DTMOS) for ultra-low voltage operation, in
-
F. Assaderaghi, D. Sinitsky, S. Parke, J. Bokor, P. Ko, and C. Hu, A dynamic threshold voltage MOSFET (DTMOS) for ultra-low voltage operation, in Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers, pp. 809-812.
-
Proc.
-
-
Assaderaghi, F.1
Sinitsky, D.2
Parke, S.3
Bokor, J.4
Ko, P.5
Hu, C.6
-
80
-
-
0030403888
-
Channel profile optimization and device design for low-power high-performance dynamic threshold MOSFET, in
-
C. Wann, F. Assaderaghi, R. Dennard, C. Hu, G. Shahidi, and Y. Taur, Channel profile optimization and device design for low-power high-performance dynamic threshold MOSFET, in Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers, pp. 113-116.
-
Proc.
-
-
Wann, C.1
Assaderaghi, F.2
Dennard, R.3
Hu, C.4
Shahidi, G.5
Taur, Y.6
-
81
-
-
0029520010
-
Back gated CMOS on SOIAS for dynamic threshold voltage control, in
-
I. Yang, C. Vieri, A. Chandrakasan, and D. Antoniadis, Back gated CMOS on SOIAS for dynamic threshold voltage control, in Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers, pp. 877-880.
-
Proc.
-
-
Yang, I.1
Vieri, C.2
Chandrakasan, A.3
Antoniadis, D.4
-
82
-
-
0027879328
-
High performance 0.1 μm CMOS devices with 1.5 V power supply, in
-
Y. Taur, S. Wind, Y. J. Mii, Y. Lii, D. Moy, K. A. Jenkins, C. L. Chen, P. J. Coane, D. Klaus, J. Bucchignano, M. Rosenfield, M. G. R. Thompson, and M. Polcari, High performance 0.1 μm CMOS devices with 1.5 V power supply, in Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers, pp. 127-130.
-
Proc.
-
-
Taur, Y.1
Wind, S.2
Mii, Y.J.3
Lii, Y.4
Moy, D.5
Jenkins, K.A.6
Chen, C.L.7
Coane, P.J.8
Klaus, D.9
Bucchignano, J.10
Rosenfield, M.11
Thompson, M.G.R.12
Polcari, M.13
-
83
-
-
0030383555
-
High speed 0.1 μm dual gate CMOS with low energy phosphorus/boron implantation and cobalt suicide, in
-
A. Hori, H. Umimoto, H. Nakaoka, M. Sekiguchi, M. Segawa, M. Arai, M. Takase, and A. Kanda, High speed 0.1 μm dual gate CMOS with low energy phosphorus/boron implantation and cobalt suicide, in Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers, pp. 575-578.
-
Proc.
-
-
Hori, A.1
Umimoto, H.2
Nakaoka, H.3
Sekiguchi, M.4
Segawa, M.5
Arai, M.6
Takase, M.7
Kanda, A.8
-
84
-
-
0029544649
-
A high performance MOSFET design with highly controllable gate length and low RC delay multilevel interconnects technology for high speed logic devices
-
K. K. Oyamatsu, N. Matsunaga, H. Igarashi, T. Yamaguchi, T. Asamura, A. Azuma, H. Shibata, and M. Kakumu, A high performance MOSFET design with highly controllable gate length and low RC delay multilevel interconnects technology for high speed logic devices, in Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers, pp. 705-708.
-
Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers
, pp. 705-708
-
-
Oyamatsu, K.K.1
Matsunaga, N.2
Igarashi, H.3
Yamaguchi, T.4
Asamura, T.5
Azuma, A.6
Shibata, H.7
Kakumu, M.8
-
85
-
-
0028744092
-
200 mm process integration for a 0.15 μm channel length CMOS technology using mixed X-ray/optical lithography
-
S. Subbanna, E. Ganin, E. Crabbe, J. Comfort, S. Wu, P. Agnello, B. Martin, M. McCord, H. Ng, T. Newman, P. McFarlanf, J. Sun, J. Snare, A. Acovic, A. Ray, R. Gehres, R. Schulz, S. Greco, K. Bcyer, L. Liebmann, R. DellaGuardia, and A. Lamberti, 200 mm process integration for a 0.15 μm channel length CMOS technology using mixed X-ray/optical lithography, in Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers, pp. 695-698.
-
Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers
, pp. 695-698
-
-
Subbanna, S.1
Ganin, E.2
Crabbe, E.3
Comfort, J.4
Wu, S.5
Agnello, P.6
Martin, B.7
McCord, M.8
Ng, H.9
Newman, T.10
McFarlanf, P.11
Sun, J.12
Snare, J.13
Acovic, A.14
Ray, A.15
Gehres, R.16
Schulz, R.17
Greco, S.18
Bcyer, K.19
Liebmann, L.20
Dellaguardia, R.21
Lamberti, A.22
more..
-
86
-
-
0029491760
-
Substantial advantages of fully-depleted CMOS/SIMOX devices as low-power high performance VLSI components compared with its bulk-CMOS counterpart
-
Y. Kado, H. Inokawa, Y. Okazaki, T. Tsuchiya, Y. Kawai, M. Sato, Y. Sakakibara, S. Nakayama, H. Yamada, M. Kitamura, S. Nakashima, K. Nishimura, S. Date, M. Ino, K. Takeya, and T. Sakai, Substantial advantages of fully-depleted CMOS/SIMOX devices as low-power high performance VLSI components compared with its bulk-CMOS counterpart, in Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers, pp. 635-638.
-
Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers
, pp. 635-638
-
-
Kado, Y.1
Inokawa, H.2
Okazaki, Y.3
Tsuchiya, T.4
Kawai, Y.5
Sato, M.6
Sakakibara, Y.7
Nakayama, S.8
Yamada, H.9
Kitamura, M.10
Nakashima, S.11
Nishimura, K.12
Date, S.13
Ino, M.14
Takeya, K.15
Sakai, T.16
-
89
-
-
0027848479
-
High performance dielectrics and processes for ULSI interconnection technologies
-
J. Paraszczak, D. Edelstein, S. Cohen, E. Babich, and J. Hummel, High performance dielectrics and processes for ULSI interconnection technologies, in Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers, pp. 261-264.
-
Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers
, pp. 261-264
-
-
Paraszczak, J.1
Edelstein, D.2
Cohen, S.3
Babich, E.4
Hummel, J.5
-
90
-
-
0028448788
-
Power consumption estimation in CMOS VLSI chip
-
June
-
D. Liu and C. Svensson, Power consumption estimation in CMOS VLSI chip, IEEE J. Solid-State Circuits, vol. 29, pp. 663-670, June 1994.
-
(1994)
IEEE J. Solid-State Circuits
, vol.29
, pp. 663-670
-
-
Liu, D.1
Svensson, C.2
-
91
-
-
0030387081
-
t MOSFET process and energy-delay measurement
-
t MOSFET process and energy-delay measurement, in Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers, pp. 851-854.
-
Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers
, pp. 851-854
-
-
Chen, Z.1
Diaz, C.2
Plummer, J.3
Cao, M.4
Greene, W.5
-
92
-
-
0028479662
-
Low-voltage and low-power ULSI circuit technique
-
M. Aoki and K. Itoh, Low-voltage and low-power ULSI circuit technique, IEICE Trans. 'Elec., vol. E77-C, no. 8, pp. 1351-1359.
-
IEICE Trans. 'Elec.
, vol.E77-C
, Issue.8 NO
, pp. 1351-1359
-
-
Aoki, M.1
Itoh, K.2
-
93
-
-
0000901940
-
Fundamental limitations in microelectronics-I. MOS technology
-
B. Hoeneisen and C. A. Mead, Fundamental limitations in microelectronics-I. MOS technology, Solid-State Electron.., vol. 15, pp. 819-829, 1972.
-
(1972)
Solid-State Electron..
, vol.15
, pp. 819-829
-
-
Hoeneisen, B.1
Mead, C.A.2
-
94
-
-
0016506999
-
Physical limits in digital electronics
-
May
-
R. W. Keyes, Physical limits in digital electronics, Proc. IEEE, vol. 63, pp. 740-766, May 1975.
-
(1975)
Proc. IEEE
, vol.63
, pp. 740-766
-
-
Keyes, R.W.1
-
95
-
-
0020240615
-
Threshold voltage variation in very small MOS transistors due to local impurity fluctuations
-
pp. 46-47.
-
T. Hagiwara, K. Yamaguchi, and S. Asai, Threshold voltage variation in very small MOS transistors due to local impurity fluctuations, in Proc. 1982 Symp. VLSI Technol., Dig. Tech. Papers, pp. 46-47.
-
Proc. 1982 Symp. VLSI Technol., Dig. Tech. Papers
-
-
Hagiwara, T.1
Yamaguchi, K.2
Asai, S.3
-
96
-
-
0027813761
-
Three-dimensional 'atomistic' simulation of discrete random dopant distribution effects in sub-0. l μm MOSFET's
-
H.-S. Won and Y. Taur, 'Three-dimensional 'atomistic' simulation of discrete random dopant distribution effects in sub-0. l μm MOSFET's, in Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers, pp. 705-708.
-
Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers
, pp. 705-708
-
-
Won, H.-S.1
Taur, Y.2
-
97
-
-
0028562790
-
Performance fluctuations of 0.10 μm MOSFETs - Limitation of 0.1 μm ULSI's
-
T. Mizuno, M. Iwase, H. Niiyama, T. Shibata, K. Fujisaki, T. Nakasugi, A. Toriumi, and U. Ushiku, Performance fluctuations of 0.10 μm MOSFETs - Limitation of 0.1 μm ULSI's, in Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers, pp. 13-14.
-
Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers
, pp. 13-14
-
-
Mizuno, T.1
Iwase, M.2
Niiyama, H.3
Shibata, T.4
Fujisaki, K.5
Nakasugi, T.6
Toriumi, A.7
Ushiku, U.8
-
98
-
-
85001841209
-
Experimantal study of threshold voltage fluctuations using an 8k MOSFET's array
-
T. Mizuno, J. Okamura, and A. Toriumi, Experimantal study of threshold voltage fluctuations using an 8k MOSFET's array, in Proc. 1993 Symp. VLSI Technol., Dig. Tech. Papers, pp. 41-42.
-
Proc. 1993 Symp. VLSI Technol., Dig. Tech. Papers
, pp. 41-42
-
-
Mizuno, T.1
Okamura, J.2
Toriumi, A.3
-
99
-
-
85056911965
-
Monte Carlo simulation of a 30 nm dual-gate MOSFET: How short can Si go?
-
D. J. Frank, S. E. Laux, and M. V. Fischetti, Monte Carlo simulation of a 30 nm dual-gate MOSFET: How short can Si go? in Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers, pp. 553-556.
-
Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers
, pp. 553-556
-
-
Frank, D.J.1
Laux, S.E.2
Fischetti, M.V.3
-
100
-
-
85081076939
-
0.01 mm SOI-MOSFET with intrinsic channel
-
Nov.
-
T. Shimatani, S. Pidin, and M. Koyanagi, 0.01 mm SOI-MOSFET with intrinsic channel, Tech. Rep. IEICE, vol. SDM-137, pp. 39-4, Nov. 1996.
-
(1996)
Tech. Rep. IEICE
, vol.SDM-137
, pp. 39-34
-
-
Shimatani, T.1
Pidin, S.2
Koyanagi, M.3
-
101
-
-
0024088911
-
Temperature scaling theory for low-temperature-operated MOSFET with deep-submicron channel
-
Y.-W. Yi, K. Masu, K. Tsubouchi, and N. Mikoshiba, Temperature scaling theory for low-temperature-operated MOSFET with deep-submicron channel, Jap. J. Appl. Phys., vol. 27, pp. L1958-L1961, 1988.
-
(1988)
Jap. J. Appl. Phys.
, vol.27
-
-
Yi, Y.-W.1
Masu, K.2
Tsubouchi, K.3
Mikoshiba, N.4
-
102
-
-
0028756728
-
Design methodology for low-voltage MOSFET's
-
T. Andoh, A. Furukawa, and T. Kunio, Design methodology for low-voltage MOSFET's, in Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers, pp. 79-82.
-
Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers
, pp. 79-82
-
-
Andoh, T.1
Furukawa, A.2
Kunio, T.3
-
103
-
-
0030164323
-
Back-gate forward bias method for low-voltage CMOS digital circuits
-
June
-
M.-J. Chen, J.-S. Ho, T.-H. Huang, C.-H. Yang, Y.-N. Jou, and T. Wu, Back-gate forward bias method for low-voltage CMOS digital circuits, IEEE Trans. Electron Devices, vol. 43, no. 6, pp. 904-910, June 1996.
-
(1996)
IEEE Trans. Electron Devices
, vol.43
, Issue.6 NO
, pp. 904-910
-
-
Chen, M.-J.1
Ho, J.-S.2
Huang, T.-H.3
Yang, C.-H.4
Jou, Y.-N.5
Wu, T.6
-
104
-
-
0028753975
-
'Technology trends of silicon-on-insulator-its advantages and problems to be solved
-
M. Yoshimi, M. Terauchi, A: Murakoshi, M. Takahashi, K. Matsuzawa, N. Shigyo, and Y. Ushiku, 'Technology trends of silicon-on-insulator-its advantages and problems to be solved, in Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers, pp. 429-432.
-
Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers
, pp. 429-432
-
-
Yoshimi, M.1
Terauchi, A.M.2
Takahashi, K.3
Matsuzawa, N.4
Shigyo, M.M.5
Ushiku, Y.6
-
105
-
-
0030399250
-
The impact of the floating body effect suppression on SOI Integrated circuits
-
M. Terauchi, A. Nishiyama, T. Mizuno, M. Yoshimi, and S. Watanabe, The impact of the floating body effect suppression on SOI Integrated circuits, in Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers, pp. 855-858.
-
Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers
, pp. 855-858
-
-
Terauchi, M.1
Nishiyama, A.2
Mizuno, T.3
Yoshimi, M.4
Watanabe, S.5
-
106
-
-
0028750685
-
A new approach to implement 0.1 μm MOSFET on thin-film SOI substrate with self-aligned source-body contact
-
V. Chen and J. Woo, A new approach to implement 0.1 μm MOSFET on thin-film SOI substrate with self-aligned source-body contact, in Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers, pp. 657-660.
-
Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers
, pp. 657-660
-
-
Chen, V.1
Woo, J.2
-
107
-
-
0030166924
-
Top-down pass-transistor logic design
-
June
-
K. Yano, Y. Sasaki, K. Rikino, and K. Seki, Top-down pass-transistor logic design, IEEE J. Solid-State Circuits, vol. 31, pp. 792-803, June 1996.
-
(1996)
IEEE J. Solid-State Circuits
, vol.31
, pp. 792-803
-
-
Yano, K.1
Sasaki, Y.2
Rikino, K.3
Seki, K.4
-
109
-
-
0015417380
-
Merged-transistor logic (MTL) - A low-cost bipolar logic concept
-
H. H. Berger and S. K. Wiedmann, Merged-transistor logic (MTL) - A low-cost bipolar logic concept, IEEE J. Solid-State Circuits, vol. SC-7, pp. 340-346, 1972.
-
(1972)
IEEE J. Solid-State Circuits
, vol.SC-7
, pp. 340-346
-
-
Berger, H.H.1
Wiedmann, S.K.2
-
110
-
-
0015416865
-
Integrated injection logic: A new approach to LSI
-
K. Hart and A. Slob, Integrated injection logic: A new approach to LSI, IEEE J. Solid-State Circuits, vol. SC-7, no. 5, pp. 346-351, 1972.
-
(1972)
IEEE J. Solid-State Circuits
, vol.SC-7
, Issue.5 NO
, pp. 346-351
-
-
Hart, K.1
Slob, A.2
-
111
-
-
33646904019
-
ArF and super-resolution techniques brings 0.1 μm pattern printing within a shooting range
-
July
-
[Ill] S. Tanimoto and K. Uemura, ArF and super-resolution techniques brings 0.1 μm pattern printing within a shooting range, Nikkei Microdevices, pp. 94-100, July 1995, in Japanese.
-
(1995)
Nikkei Microdevices
, pp. 94-100
-
-
Tanimoto, S.1
Uemura, K.2
-
112
-
-
0020249292
-
Improving resolution in photolithography with masks
-
M. D. Levenson, N. S. Visawanathan, and R. A. Simpson, Improving resolution in photolithography with masks, IEEE Trans. Electron Devices, vol. ED-29, pp. 1828-1836, 1982.
-
(1982)
IEEE Trans. Electron Devices
, vol.ED-29
, pp. 1828-1836
-
-
Levenson, M.D.1
Visawanathan, N.S.2
Simpson, R.A.3
-
113
-
-
0027814102
-
Evaluation of pupil-filtering in high-numerical-aperture I-line lens
-
H. Fukuda, Y. Kobayashi, K. Hama, T. Tawa, and S. Okazaki, Evaluation of pupil-filtering in high-numerical-aperture I-line lens, Jap. J. Appl. Phys., vol. 32, pp. 5845-5849, 1994.
-
(1994)
Jap. J. Appl. Phys.
, vol.32
, pp. 5845-5849
-
-
Fukuda, H.1
Kobayashi, Y.2
Hama, K.3
Tawa, T.4
Okazaki, S.5
-
114
-
-
0029223304
-
Lithography for ULSI
-
Mar.
-
S. Okazaki, Lithography for ULSI, Proc. SPIE, voL 2440, pp. 18-32, Mar. 1995.
-
(1995)
Proc. SPIE
, vol.2440
, pp. 18-32
-
-
Okazaki, S.1
-
115
-
-
0029727970
-
Patterning ULSI circuits
-
Mar.
-
J. Carruthers, Patterning ULSI circuits, Proc. SPIE, vol. 2440, pp. 2-11, Mar. 1996.
-
(1996)
Proc. SPIE
, vol.2440
, pp. 2-11
-
-
Carruthers, J.1
-
116
-
-
84989071862
-
High-resolution pattern replication using soft X-rays
-
D. L. Spears and H. I. Smith, High-resolution pattern replication using soft X-rays, Electron. Lett., vol. 8, no. 4, pp. 102-103, 1972.
-
(1972)
Electron. Lett.
, vol.8
, Issue.4 NO
, pp. 102-103
-
-
Spears, D.L.1
Smith, H.I.2
-
117
-
-
0030422231
-
240 nm pitch 4GDRAM array MOSFET technologies with X-ray lithography
-
K. Sunouchi, H. Kawaguchiya, S. Matsuda, H. Nomura, T. Shino, K. Murooka, S. Sugihara, S. Mitusi, K. Kondo, K. Kikuchi, K. Deguchi, M. Fukuda, M. Oda, S. Uchiyama, M. Suzuki, T. Watanabe, and K. Yamada, 240 nm pitch 4GDRAM array MOSFET technologies with X-ray lithography, in Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers, pp. 601-604.
-
Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers
, pp. 601-604
-
-
Sunouchi, K.1
Kawaguchiya, H.2
Matsuda, S.3
Nomura, H.4
Shino, T.5
Murooka, K.6
Sugihara, S.7
Mitusi, S.8
Kondo, K.9
Kikuchi, K.10
Deguchi, K.11
Fukuda, M.12
Oda, M.13
Uchiyama, S.14
Suzuki, M.15
Watanabe, T.16
Yamada, K.17
-
118
-
-
0029543660
-
3 stacked capacitors using X-ray lithography
-
3 stacked capacitors using X-ray lithography, in Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers, pp. 903-906.
-
Proc. 1996 IEEE Int. Elecron Devices Meet., Dig. Tech. Papers
, pp. 903-906
-
-
Nishioka, Y.1
Shiozawa, K.2
Oishi, T.3
Kawamoto, K.4
Tokuda, Y.5
Sumitani, H.6
Aya, S.7
Yabe, H.8
Itoga, K.9
Hifumi, T.10
Marumoto, K.11
Kuroiwa, T.12
Kawahara, T.13
Nishikawa, K.14
Oomori, T.15
Fujino, T.16
Yamamoto, S.17
Uzawa, S.18
Kimata, M.19
Nunoshita, M.20
Abe, H.21
more..
-
119
-
-
0030231816
-
X-ray nanolithography: Extension to the limits of lithographic process
-
H. I. Smith, M. L. Schattenburg, S. D. Hector, J. Ferrera, E. E. Moon, I. Y. Yang, and M. Burkhardt, X-ray nanolithography: Extension to the limits of lithographic process, Microelectronic . Eng., vol. 32, pp. 143-158, 1996.
-
(1996)
Microelectronic . Eng.
, vol.32
, pp. 143-158
-
-
Smith, H.I.1
Schattenburg, M.L.2
Hector, S.D.3
Ferrera, J.4
Moon, E.E.5
Yang, I.Y.6
Burkhardt, M.7
-
120
-
-
0029543172
-
2 dual gate process
-
Kyoto
-
2 dual gate process, in Proc. Symp. VLSI Technol., Dig. Tech. Papers, Kyoto, 1995, pp. 9-10.
-
(1995)
Proc. Symp. VLSI Technol., Dig. Tech. Papers
, pp. 9-10
-
-
Takeuchi, K.1
Yamamoto, T.2
Furukawa, A.3
Tamura, T.4
Yoshida, K.5
-
121
-
-
0030231574
-
Electron beam lithography-resolution limits
-
A. Broers, A. C. F. Hoole, and J. M. Ryan, Electron beam lithography-resolution limits, Microelectron. Eng., vol. 32, pp. 131-142, 1996.
-
(1996)
Microelectron. Eng.
, vol.32
, pp. 131-142
-
-
Broers, A.1
Hoole, A.C.F.2
Ryan, J.M.3
-
122
-
-
0030231712
-
Electron beam lithography - SEM to microcolumn
-
T. H. P. Chang, M. G. R. Thompson, M. L. Yu, E. Kratschmer, H. S. Kirn, K. Y. Lee, S. A. Rishton, and S. Zolgharnain, Electron beam lithography - SEM to microcolumn, Microelectron. Eng., vol. 32, pp. 113-130, 1996.
-
(1996)
Microelectron. Eng.
, vol.32
, pp. 113-130
-
-
Chang, T.H.P.1
Thompson, M.G.R.2
Yu, M.L.3
Kratschmer, E.4
Kirn, H.S.5
Lee, K.Y.6
Rishton, S.A.7
Zolgharnain, S.8
-
123
-
-
0000505521
-
Electron-beam cell projection lithography: A new high-throughput electron-beam direct-writing technology using a specially tailored Si aperture
-
June
-
Y. Nakayama, S. Okazaki, N. Saitou, and H. Wakabayashi, Electron-beam cell projection lithography: A new high-throughput electron-beam direct-writing technology using a specially tailored Si aperture, J. Vac. Sci. Tech., vol. B8, no. 6, pp. 1836-1840, June 1990.
-
(1990)
J. Vac. Sci. Tech.
, vol.B8
, Issue.6 NO
, pp. 1836-1840
-
-
Nakayama, Y.1
Okazaki, S.2
Saitou, N.3
Wakabayashi, H.4
-
124
-
-
34848919386
-
Surface studies by scanning tunneling microscopy
-
G. Binnig, H. Rohrer, C. Gerber, and E. Weibel, Surface studies by scanning tunneling microscopy, Phys. Rev. Lett., vol. 49, no. 1, pp. 57-61, 1982.
-
(1982)
Phys. Rev. Lett.
, vol.49
, Issue.1 NO
, pp. 57-61
-
-
Binnig, G.1
Rohrer, H.2
Gerber, C.3
Weibel, E.4
-
125
-
-
0000662039
-
Lift-off metallization using poly(methyl methacrylate) expose with a scanning tunneling microscope
-
Jan./Feb.
-
M. McCord and R. F. W. Pease, Lift-off metallization using poly(methyl methacrylate) expose with a scanning tunneling microscope, J. Vac. Sci. Technol., vol. B6, no. 1, pp. 293-296, Jan./Feb. 1988.
-
(1988)
J. Vac. Sci. Technol.
, vol.B6
, Issue.1 NO
, pp. 293-296
-
-
McCord, M.1
Pease, R.F.W.2
-
126
-
-
21544435813
-
Low voltage electron beam lithography in self-assembled ultrathin films with the scanning tunneling microscope
-
Jan.
-
C. R. K. Marrian, F. K. Perkins, S. L. Brandow, T. S. Koloski, E. A. Dobitz, and J. M. Calvert, Low voltage electron beam lithography in self-assembled ultrathin films with the scanning tunneling microscope, Appl. Phys. Lett., vol. 64, no. 3, pp. 390-392 Jan. 1994.
-
(1994)
Appl. Phys. Lett.
, vol.64
, Issue.3 NO
, pp. 390-392
-
-
Marrian, C.R.K.1
Perkins, F.K.2
Brandow, S.L.3
Koloski, T.S.4
Dobitz, E.A.5
Calvert, J.M.6
-
127
-
-
36449004659
-
Nanoscale patterning and oxidation of H-passivated Si (100) 2 × 1 surfaces with an ultrahigh vacuum scanning tunneling microscope
-
Apr.
-
J. W. Lyding, T. C. Shen, J. S. Hubacek, J. Tucker, and G. Abeln, Nanoscale patterning and oxidation of H-passivated Si (100) 2 × 1 surfaces with an ultrahigh vacuum scanning tunneling microscope, Appl. Phys. Lett., vol. 64, no. 15, pp. 2010-2012, Apr. 1994.
-
(1994)
Appl. Phys. Lett.
, vol.64
, Issue.15 NO
, pp. 2010-2012
-
-
Lyding, J.W.1
Shen, T.C.2
Hubacek, J.S.3
Tucker, J.4
Abeln, G.5
-
128
-
-
36449008120
-
Fabrication of 0.1 μm metal oxide semiconductor field effect transistors with the atomic force microscope
-
Feb.
-
S. C. Minne, H. T. Soh, Ph. Flueckiger, and C. F. Quate, Fabrication of 0.1 μm metal oxide semiconductor field effect transistors with the atomic force microscope, Appl. Phys. Lett., vol. 646, no. 6, pp. 703-705, Feb. 1995.
-
(1995)
Appl. Phys. Lett.
, vol.646
, Issue.6 NO
, pp. 703-705
-
-
Minne, S.C.1
Soh, H.T.2
Flueckiger, P.3
Quate, C.F.4
-
129
-
-
0030234520
-
Downscaling ULSIs by using nanoscale engineering
-
S. Asai, Y. Wada, and E. Takeda, Downscaling ULSIs by using nanoscale engineering, Microelectron. Eng., vol. 32, pp. 31-48, 1996.
-
(1996)
Microelectron. Eng.
, vol.32
, pp. 31-48
-
-
Asai, S.1
Wada, Y.2
Takeda, E.3
-
130
-
-
0027591398
-
Design for reliability: The major challenge for VLSI
-
May
-
P. Yang and J.-H. Chern, Design for reliability: The major challenge for VLSI, Proc. IEEE, vol. 81, no. 5, pp. 730-744, May 1993.
-
(1993)
Proc. IEEE
, vol.81
, Issue.5 NO
, pp. 730-744
-
-
Yang, P.1
Chern, J.-H.2
-
131
-
-
0027590609
-
ULSI reliability through ultraclean processing
-
May
-
T. Ohmi, ULSI reliability through ultraclean processing, Proc. IEEE, vol. 81, no. 5, pp. 716-729, May 1993.
-
(1993)
Proc. IEEE
, vol.81
, Issue.5 NO
, pp. 716-729
-
-
Ohmi, T.1
|