SUBMICRON WIRING TECHNOLOGY WITH TUNGSTEN AND PLANARIZATION.

Technical Digest - International Electron Devices Meeting

Volumn , Issue , 1987, Pages 209-212

  Kaanta, Carter ^a   Cote, William ^a   Cronin, John ^a   Holland, Karey ^a   Lee, Pei Ing ^a   Wright, Terry ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUITS, VLSI - FABRICATION;

CHEMICAL VAPOR DEPOSITED TUNGSTEN (CVD-W); PLANARIZATION; SUBMICRON WIRING TECHNOLOGY;

TUNGSTEN AND ALLOYS;

EID: 0023592415     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/iedm.1987.191389     Document Type: Conference Paper

References (9)