High performance dielectrics and processes for ULSI interconnection technologies

Technical Digest - International Electron Devices Meeting, IEDM

Volumn , Issue , 1993, Pages 261-264

  Paraszczak, J ^a   Edelstein, D ^a   Cohen, S ^a   Babich, E ^a   Hummel, J ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DELAY CIRCUITS; INTEGRATED CIRCUIT INTERCONNECTS; COPPER; ELECTRIC CONNECTORS; POLYMERS; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON;

'CURRENT; ALUMINUM CONDUCTORS; COPPER CONDUCTORS; INDIVIDUAL DEVICES; INTEGRATION ISSUES; INTERCONNECTION TECHNOLOGY; PERFORMANCE; PERFORMANCE BENEFITS; SILICON INTEGRATED CIRCUITS;

COPPER; ULSI CIRCUITS;

HIGH PERFORMANCE DIELECTRICS; INTEGRATION; INTERCONNECTIONS;

EID: 0027848479     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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