Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 4, 2001, Pages 499-506

  Pang, John H L ^a   Chong, D Y R ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Finite element; Flip chip; Reliability; Solder joint

Indexed keywords

ACCELERATED THERMAL CYCLING; FATIGUE LIFE PREDICTION; FLIP-CHIP-ON-BOARD ASSEMBLY; SOLDER JOINT RELIABILITY ANALYSIS; THERMAL SHOCK RELIABILITY TEST; THERMOMECHANICAL RELIABILITY ANALYSIS;

FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; PLASTIC DEFORMATION; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS; STRAIN; STRESS ANALYSIS; THERMAL CYCLING; THERMAL EXPANSION; TIN ALLOYS;

FLIP CHIP DEVICES;

EID: 0035521094     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.982836     Document Type: Article

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