SCOPUS 정보 검색 플랫폼

Jinshu Xuebao/Acta Metallurgica Sinica

Volumn 42, Issue 6, 2006, Pages 647-652

Microstructure and fracture of Pb-free solder interconnects in CBGA packages under thermal cycling

(4) Wang, Wei a Wang, Zhongguang a Xian, Aiping a Shang, Jianku a,b

a INSTITUTE OF METAL RESEARCH (China)

b UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN (United States)

Author keywords

Ceramic ball grid array (CBGA); Finite element method; Interconnect; Pb free solder; Thermal cycling

Indexed keywords

ARRAYS; CERAMIC MATERIALS; COPPER ALLOYS; CRACKS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FRACTURE; INTERMETALLICS; MICROSTRUCTURE; MORPHOLOGY; SILVER ALLOYS; THERMAL CYCLING; TIN ALLOYS;

CERAMIC BALL GRID ARRAY (CBGA); FATIGUE CRACK; INTERCONNECT; PB-FREE SOLDER;

SOLDERING ALLOYS;

EID: 33747065808 PISSN: 04121961 EISSN: None Source Type: Journal
DOI: None Document Type: Article

Times cited : (7)

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