Applying Anand model to represent the viscoplastic deformation behavior of solder alloys

Journal of Electronic Packaging

Volumn 123, Issue 3, 2001, Pages 247-253

  Wang, G Z ^a   Cheng, Z N ^a   Becker, K ^b   Wilde, J ^c  

^a DaimlerChrysler SIM Technology Co Ltd   (China)

^b Bingen University of AP   (Germany)

^c UNIVERSITY OF FREIBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0040748904     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1371781     Document Type: Article

References (27)

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