Board level drop test and simulation of leaded and lead-free BGA-PCB assembly

Microelectronics Reliability

Volumn 47, Issue 12, 2007, Pages 2197-2204

  Qu, Xin ^a   Chen, Zhaoyi ^a   Qi, Bo ^a   Lee, Taekoo ^b   Wang, Jiaji ^a  

^a FUDAN UNIVERSITY   (China)

^b Samsung Semiconductor China R and D Co Ltd   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT SIMULATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; SOLDERED JOINTS;

BALL GRID ARRAY (BGA) COMPONENTS; SOLDER-PAD INTERFACE;

PRINTED CIRCUIT BOARDS;

EID: 35648968617     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.10.017     Document Type: Article

References (23)

1. Available from: http://leadfree.ipc.org/RoHS_2-1.asp.
2. Darveaux R, Syed A. Reliability of area array solder joints in bending. In: SMTA international proceedings of the technical program, Rosemont, September; 2000. p. 313-24.
3. Huang TC, Lai DP, et al. Reliability and failure analysis of CSP under bending cycle test. In: International symposium microelectronics; 2000.
4. Yamaji Y, Suzuki T, Yamasaki H, et al. New evaluation methods of CSPs board level reliability using strain gauge. In: Proceedings of 50th electronic packaging technology conference, May 21-24; 2000. p. 1398-404.
5. Mishiro K., Ishikawa S., Abe M., et al. Effect of the drop impact on BGA/CSP package reliability. Microelectron Reliab 42 (2002) 77-82
6. Lim C.T., Teo Y.M., and Shim V.P.W. Numerical simulation of the drop impact response of a portable electronic product. IEEE Trans Compon Pack Technol 25 (2002) 478-485
7. Tee T.Y., Ng H.S., Lim C.T., et al. Impact life prediction modeling of TFBGA packages under board level drop test. Microelectron Reliab 44 (2004) 1131-1142
8. Zhu L., and Marcinkiewicz W. Drop impact reliability analysis of CSP packages at board and product levels through modeling approaches. IEEE Trans Compon Pack Technol 28 (2005) 449-456
9. Tan V.B.C., Tong M.X., Lim K.M., et al. Finite element modeling of electronic packages subjected to drop impact. IEEE Trans Compon Pack Technol 28 (2005) 555-560
10. Lai Y.S., Yang P.F., and Yeh C.L. Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. Microelectron Reliab 46 (2006) 645-650
11. Liu Y.L., Tian G.Y., Gale S., et al. Lead-free chip scale packages: assembly and drop test reliability. IEEE Trans Electron Pack Manuf 29 (2006) 1-9
12. Wang Y.Q., Low K.H., Pang H.L.J., et al. Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards. Microelectron Reliab 46 (2006) 558-573
13. Darveaux R., Banerji K., Mawer A., and Dody G. Reliability of plastic ball grid array assembly. In: Lau J. (Ed). Ball grid array technology (1995), McGraw-Hill, New York
14. Darveaux R. Solder joint fatigue life model. In: Proceedings of a symposium held during the TMS annual meeting, Orlando, February; 1997. p. 213-8.
15. Darveaux R. Effect of simulation methodology on solder joint crack growth correlation. In: Proceedings Of 50th electronic components and technology conference, Las Vegas, May; 2000. p. 1048-58.
16. JEDEC: 'JESD22-B111: Board level drop test method of components for handheld electronic products'; 2003.
17. Engelmaier W, Fatigue life of leadless chip carrier solder joints during power C cling. In: Proceedings of annual international electronics packaging society conference, San Diego, CA; 1982.
18. Solomon HD. Fatigue of 60/40 Solder. In: Proceedings of 38 electronic components conference, Seattle, WA; 1986.
19. Tee TY, Ng HS, Lini CT, et al. Board level drop test and simulation of TFBGA packages for telecommunication applications. In: Proceedings of 53rd ECTC conference; 2003. p. 121-9.
20. Dasgupta A., Oyan C., Barker D., et al. Solder creep-fatigue analysis by an energy-partitioning approach. ASME J Electron Pack 114 (1992) 152-160
21. Shi X.Q., Pang H.L.J., Zhou W., et al. A modified energy-based low cycle fatigue model for eutectic solder alloy. Scripta Mater 41 3 (1999) 289-296
22. Solomon H.D., and Tolksdorf E.D. Energy approach to the fatigue of 60140 solder. Part I - Influence of temperature and cycle frequency. ASME J Electron Pack 117 2 (1995) 130-135
23. Anderson T., Guven I., and Madenci E. The necessity of reexamining previous life prediction analyses of solder joints in electronic packages. IEEE Trans Compon Pack Technol 23 3 (2000) 516-520