Coffin-Manson equation of Sn-4.0Ag-0.5Cu solder joint

Soldering and Surface Mount Technology

Volumn 21, Issue 2, 2009, Pages 48-54

  Chen, S ^a   Sun, P ^a,b   Wei, X C ^a   Chang, Z N ^a   Liu, J ^a,b  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

Finite element analysis; Joining processes; Shear strength; Soldering; Stress (materials)

Indexed keywords

CAM SYSTEMS; CERAMIC BODIES; COFFIN-MANSON EQUATION; CRACK INITIATION AND PROPAGATION; DESIGN/METHODOLOGY/APPROACH; EXPERIMENTAL DATA; FAILURE CRITERIA; FATIGUE LIFE; FINITE ELEMENT ANALYSIS; JOINING PROCESSES; JOINT RELIABILITY; LEAD-FREE SOLDER JOINT; NOVEL DEVICES; OPTICAL MICROSCOPES; SEM; SIMULATION RESULT; SOLDER JOINT RELIABILITY; SOLDER JOINTS; SOLDER MATRIX; STRESS (MATERIALS); STRESS AND STRAIN;

FAILURE ANALYSIS; FINITE ELEMENT METHOD; JOINING; LEAD; PHOTOGRAPHY; RELIABILITY ANALYSIS; RESISTORS; SHEAR STRAIN; SHEAR STRENGTH; SILVER; SOLDERING; SOLDERING ALLOYS;

TIN;

EID: 70349225812     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910910947471     Document Type: Article

References (6)

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2. Pang, J.H.L., Xiong, B.S. and Low, T.H. (2004), "Low comprehensive mechanics characterization of lead-free 95.5Sn-3.8Ag-0.7Cu", Micromaterials and Nanomaterials, No. 3, pp. 86-93.
3. Ridout, S., Dusek, M., Bailey, C. and Hunt, C. (2006), "Assessing the performance of crack detection tests for solder joints", Microelectronics Reliability, Vol. 46, pp. 2122-30.
4. Stepniak, F. (2004), "Mechanical loading of filp chip joints before underfill: the impact on yield and reliability", Microelectronics Reliability, Vol. 44, pp. 805-14.
5. Sun, P., Andersson, C., Cheng, Z., Lai, Z., Shangguan, D. and Liu, J. (2005), "Coffin-Mason equation determination for Sn-Zn based lead-free solder joints", The 7th International IEEECPMTSymposium on High Density DesignPackaging and Microsystem Integration, June 27-30, pp. 342-7.
6. Wiese, S. and Rzepka, S. (2004), "Time-independent elasticplastic behaviour of solder materials", Microelectronics Reliability, Vol. 44, pp. 1893-900.