The effects of temperature cyclic loading on lead-free solder joints of wafer level chip scale package by Taguchi method

Journal of Electronic Packaging

Volumn 130, Issue 1, 2008, Pages 0110011-01100110

  Jong, Wen Ren ^a   Tsai, Hsin Chun ^b   Chang, Hsiu Tao ^a   Peng, Shu Hui ^a  

^a CHUNG YUAN CHRISTIAN UNIVERSITY   (Taiwan)

^b MINGHSIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Lead free solder; Taguchi method; Temperature cyclic loading; Wafer level chip scale package (WLCSP)

Indexed keywords

CHIP SCALE PACKAGES; LOW TEMPERATURE EFFECTS; PARAMETER ESTIMATION; PRINTED CIRCUIT BOARDS; SHEAR STRAIN; TAGUCHI METHODS;

LEAD-FREE SOLDER; LOADING PARAMETERS; TEMPERATURE CYCLIC LOADING; WAFER LEVEL CHIP SCALE PACKAGE (WLCSP);

SOLDERED JOINTS;

EID: 44449153847     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2837508     Document Type: Article

References (17)

1. Wiese, S., and Meusel, E., 2003, "Characterization of Lead-Free Solders in Flip-Chip Joints," ASME J. Electron. Packag., 125, pp. 531-538.
2. Darveaux, R., and Banerji, K., 1991, "Fatigue Analysis of Flip Chip Assemblies Using Thermal Stress Simulations and a Coffin-Manson Relation," 41st Electronic Components and Technology Conference, May, pp. 797-805.
3. Yu, Q., and Shiratori, M., 1997, "Fatigue Strength Prediction of Microelectronic Solder Joints Under Thermal Cyclic Loading," IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 20(3), pp. 226-273.
4. Ghaffarian, R., and Kim, N. P., 2001, "Effect of Thermal Cycling Ramp Rate on CSP Assembly Reliability," Proceedings of the 51st Electronic Components and Technology Conference, May, pp. 1170-1174.
5. Pang, J. H. L., and Low, T. H., 2002, "Modeling Thermal Cycling and Thermal Shock Tests for FCOB," Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, May, pp. 987-992.
6. Pitarresi, J., Chaparala, S., Sammakia, B., Nguyen, L., Patwardhan, V., Zhang, L., and Kelkar, N., 2002, "A Parametric Solder Joint Reliability Model for Wafer Level-Chip Scale Package," Proceedings of the 52nd Electronic Components and Technology Conference, San Diego, CA, pp. 1323-1328.
7. Zhai, C. J., Sidharth, and Blish, R. II, 2003, "Board Level Solder Reliability vs. Ramp Rate & Dwell Time During Temperature Cycling," IEEE 03CH37400, 41st Annual International Reliability Physics Symposium, pp. 447-451.
8. Mertol, A., 2000, "Application of the Taguchi Method to Chip Scale Package (CSP) Design," IEEE Trans. Adv. Packag., 23(2), pp. 266-276.
9. Jong, W. R., Chen, S. C, Tsai, H. C, Chiu, C. C, and Chang, H. T., 2006, "The Geometrical Effects of Bumps on the Fatigue Life of Flip-Chip Packages by Taguchi Method," J. Reinf. Plast. Compos., 25(1).
10. Roy, R. K., 1990, A Primer on the Taguchi Method, Van Nostrand Reinhold, New York.
11. Lau, J. H., Pan, S. H., and Chang, C, 2002, "Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 1001n Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board," ASME J. Electron. Packag., 124(2), pp. 69-76.
12. Thanachayanont, C., and Ramungul, N., 2002, "Low-Cost Lead-Free Solder for EE Industries," IEEE ICIT'02, Bangkok, Thailand, Dec. pp. 1213-1218.
13. Lau, J. H., Dauksher, W., and Smetana, J., 2003, "HDPUG's Design for Lead-Free Solder Joint Reliability of High-Density Packages," Presented at IPC SMEMA Council APEX®, pp. S42-2-1-S42-2-13, http://www.GoAPEX.org
14. Hong, B. Z., 1998, "Thermal Fatigue Analysis of a CBGA Package With Lead-free Solder Fillets," Proceedings of the Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, May, pp. 205-211.
15. Pang, J. H. L., Xiong, B. S., and Che, F. X., 2004, "Modeling Stress Strain Curves for Lead-Free 95.5Sn-3.8Ag-0.7Cu Solder," Proceeding of the Fifth International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, May, pp. 449-453.
16. Vianco, P. T., Rejent, J. A., and Kilgo, A. C, 2003, "Time- Independent Mechanical and Physical Properties of the Ternary 95.5Sn-3.9Ag-0.6Cu Solder," J. Electron. Mater., 32(3), pp. 142-151.
17. ANSYS, 2004, Nonlinear Structural Analysis, ANSYS Users' Manual, Release 8.1.