Study on mechanical properties and numerical simulation of fine pitch devices soldered joints

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 29, Issue 10, 2008, Pages 89-92

  Zhang, Liang ^a   Xue, Songbai ^a   Zeng, Guang ^a   Han, Zongjie ^a   Yu, Shenglin ^a,b  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

Author keywords

Fine pitch devices; Fracture microstructure; Nonlinear finite element; Reflow soldering

Indexed keywords

BRAZING; FLIP CHIP DEVICES; FRACTURE; FRACTURE TOUGHNESS; LEAD; MECHANICAL PROPERTIES; MECHANISMS; MICROSTRUCTURE; SOLDERED JOINTS; SOLDERING; WELDING;

ANALYTICAL RESULTS; FINE PITCH DEVICES; FINITE ELEMENT SIMULATIONS; FRACTURE MECHANISMS; IR REFLOWS; LEAD-FREE SOLDERS; NONLINEAR FINITE ELEMENT; NONLINEAR STRAINS; NUMERICAL SIMULATIONS; REFLOW SOLDERING; SN-AG-CU; TEMPERATURE CYCLIC LOADINGS; TENSILE FORCES;

BRITTLE FRACTURE;

EID: 55949133198     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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