Numerical simulation on soldered joints of QFP device with different substrate materials and thicknesses

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 29, Issue 1, 2008, Pages 35-39

  Zhang, Liang ^a   Xue, Songbai ^a   Lu, Fangyan ^a   Han, Zongjie ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Finite element method; Maximum stress; Substrate materials; Substrate thickness

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; RESIDUAL STRESSES; VISCOPLASTICITY;

MAXIMUM STRESS; QFP DEVICES; SUBSTRATE MATERIALS; SUBSTRATE THICKNESS;

SOLDERED JOINTS;

EID: 40449106167     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)