Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP

Microelectronics Reliability

Volumn 48, Issue 8-9, 2008, Pages 1167-1170

  Sun, F ^a   Hochstenbach, P ^b   Van Driel, W D ^b,c   Zhang, G Q ^b,c  

^a HARBIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b NXP SEMICONDUCTORS   (Netherlands)

^c DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; FRACTURE; INTERMETALLICS; LEAD-FREE SOLDERS; SILVER; SOLDERING; SOLDERING ALLOYS;

ETCHING TECHNIQUE; FRACTURE MECHANISMS; FRACTURE MORPHOLOGY; FRACTURE PERFORMANCE; KEY INFLUENCING FACTORS; STORAGE TEMPERATURES; UNDER BUMP METALLIZATION; WAFER-LEVEL CHIP SCALE PACKAGES;

BRITTLE FRACTURE;

EID: 50249138358     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.06.011     Document Type: Article

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