Thermal cycle reliability and failure mechanisms of CCGA and PBGA assemblies with and without corner staking

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 2 SPEC. ISS., 2008, Pages 285-296

  Ghaffarian, Reza ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Ball grid array (BGA); Ceramic column grid array (CCGA); Column grid array (CGA); Inspection; Plastic ball grid array (PBGA); Solder joint; Stake; Thermal cycle

Indexed keywords

AEROSPACE APPLICATIONS; BALL GRID ARRAYS; BRAZING; CERAMIC MATERIALS; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; FAILURE ANALYSIS; INSPECTION; MACHINE DESIGN; MILITARY APPLICATIONS; POLYIMIDES; POLYMERS; QUALITY ASSURANCE; SAFETY FACTOR; SCANNING ELECTRON MICROSCOPY; SPHERES; THERMAL CYCLING; WELDING;

BALL GRID ARRAY (BGA); CERAMIC COLUMN GRID ARRAY (CCGA); COLUMN GRID ARRAY (CGA); PLASTIC BALL GRID ARRAY (PBGA); SOLDER JOINT; STAKE; THERMAL CYCLE;

PLASTICS;

EID: 65349110010     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.921626     Document Type: Conference Paper

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