Cyclic mechanical durability of Sn3.0Ag0.5Cu Pb-free solder alloy

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 5, Issue , 2005, Pages 331-337

  Cuddalorepatta, Gayatri ^a   Dasgupta, Abhijit ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CYCLIC MECHANICAL DURABILITY; CYCLIC WORK DISSIPATION; SN3.0AG0.5CU SOLDER; THERMO-MECHANICAL-MICROSCALE (TMM) TEST SYSTEM;

COPPER ALLOYS; DURABILITY; EUTECTICS; LEAD ALLOYS; THERMAL CYCLING; TIN ALLOYS;

SOLDERING ALLOYS;

EID: 33645075462     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2005-81171     Document Type: Conference Paper

References (15)

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