Finite element analysis on reliability of soldered joint of J-lead

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 26, Issue 12, 2005, Pages 85-88

  Wu, Yu Xiu ^a   Xue, Song Bai ^a   Hu, Yong Fang ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Finite element; Small outline J lead package; Soldered joint; Stress

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; RELIABILITY; RIGIDITY; STRAIN; STRESSES; SURFACE MOUNT TECHNOLOGY; THERMODYNAMICS;

SMALL OUTLINE J-LEAD PACKAGE; SOLDERED HEEL; SOLDERED TOE; THERMODYNAMIC MODEL;

SOLDERED JOINTS;

EID: 33644964131     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

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