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Volumn Part F133492, Issue , 1998, Pages 1298-1304

Improvement in reliability with CCGA column density increase to 1 mm pitch

Author keywords

[No Author keywords available]

Indexed keywords

ANTHROPOMETRY; AUTOMOBILE BODIES; BALL GRID ARRAYS; CERAMIC MATERIALS; DIGITAL STORAGE; ELECTRONICS PACKAGING; FAILURE ANALYSIS; MATRIX ALGEBRA; NETWORK COMPONENTS; SHOCK TESTING; SOLDERED JOINTS; SOLDERING ALLOYS; THERMAL FATIGUE; THERMAL INSULATION; VIBRATIONS (MECHANICAL); PRINTED CIRCUIT BOARDS; SEMICONDUCTOR DEVICE TESTING; STRESS ANALYSIS; THERMAL CYCLING;

EID: 0031632978     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678910     Document Type: Conference Paper
Times cited : (6)

References (6)
  • 3
    • 85053925284 scopus 로고    scopus 로고
    • Ph. D, Harjinder Ladhar, Solectron Corp IEEE/CPMT International Electronics Manufacturers Technical Symposium
    • Shelgon Yee, " The Influence of Pad Geometry on CBGA Solder Joint Reliability", Ph. D, Harjinder Ladhar, Solectron Corp, 1996 IEEE/CPMT International Electronics Manufacturers Technical Symposium.
    • (1996) The Influence of Pad Geometry on CBGA Solder Joint Reliability
    • Yee, S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.