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Volumn Part F133492, Issue , 1998, Pages 1298-1304
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Improvement in reliability with CCGA column density increase to 1 mm pitch
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Author keywords
[No Author keywords available]
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Indexed keywords
ANTHROPOMETRY;
AUTOMOBILE BODIES;
BALL GRID ARRAYS;
CERAMIC MATERIALS;
DIGITAL STORAGE;
ELECTRONICS PACKAGING;
FAILURE ANALYSIS;
MATRIX ALGEBRA;
NETWORK COMPONENTS;
SHOCK TESTING;
SOLDERED JOINTS;
SOLDERING ALLOYS;
THERMAL FATIGUE;
THERMAL INSULATION;
VIBRATIONS (MECHANICAL);
PRINTED CIRCUIT BOARDS;
SEMICONDUCTOR DEVICE TESTING;
STRESS ANALYSIS;
THERMAL CYCLING;
ACCELERATED THERMAL CYCLING;
CERAMIC BALL GRID ARRAYS;
CERAMIC COLUMN GRID ARRAY;
INSULATION RESISTANCE;
INTERCONNECT DENSITIES;
PACKAGE INTERCONNECTS;
PACKAGE TECHNOLOGIES;
PRINTED CIRCUIT BOARDS (PCB);
CERAMIC COLUMN GRID ARRAY (CCGA) PACKAGES;
PRINTED CIRCUIT BOARDS;
ELECTRONICS PACKAGING;
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EID: 0031632978
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ECTC.1998.678910 Document Type: Conference Paper |
Times cited : (6)
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References (6)
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