Design of solder joint structure for flip chip package with an optimized shear test method

Journal of Electronic Materials

Volumn 36, Issue 6, 2007, Pages 690-696

  Kim, Jong Woong ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Finite element analysis; Flip chip; Optimization; Shear test; Solder

Indexed keywords

SHEAR FORCE; SHEAR SPEED; SHEAR TESTS; SOLDER BUMPS;

FINITE ELEMENT METHOD; FLIP CHIP DEVICES; OPTIMIZATION; SHEAR STRESS; SOLDERING ALLOYS; TIN ALLOYS;

SOLDERED JOINTS;

EID: 34249877158     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0140-6     Document Type: Article

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