Durability properties characterization of sn62pb36ag2 solder alloy

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 2000-AG, Issue , 2000, Pages 181-187

  Haswell, Peter ^a   Dasgupta, Abhijit ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; DURABILITY; EUTECTICS; HYSTERESIS; LEAD ALLOYS; LEAD-FREE SOLDERS; OUTAGES; SHEAR FLOW; SILVER ALLOYS; TIN ALLOYS;

CYCLIC DURABILITY; DURABILITY PROPERTY; HYSTERESIS ENERGIES; INELASTIC STRAIN ENERGY; MICROSTRUCTURAL TESTS; PROPERTY CHARACTERIZATIONS; SOLDER ALLOYS; TEST APPARATUS; THERMO-MECHANICAL; TOTAL STRAIN;

STRAIN RATE;

EID: 34249863497     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2000-2269     Document Type: Conference Paper

References (11)

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10. Vaynman, S., Fine, M. E., 1991, "Isothermal Fatigue of 62Sn-36Pb-2Ag Solder," Mechanical Behavior of Materials and Structures in Microelectronics, Materials Research Society Symposium Proceedings (E. Suhir, R.C. Cammarata, D.D.L. Chung, M. Jono eds.), Vol. 226, Anaheim, CA, pp. 3-13.
11. Vaynman, S., McKeown, S. A., 1993, "Energy-Based Methodology for the Fatigue Life Prediction of Solder Materials," IEEE Trans. CHMT, Vol. 16, pp. 317-322.