Optimum simulation and prediction on thermal fatigue life of soldered joints of QFP devices

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 27, Issue 8, 2006, Pages 99-102

  Wu, Yuxiu ^a   Xue, Songbai ^a   Zhang, Ling ^a   Huang, Xiang ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Equivalent strain; Finite element method; QFP; Soldered joint; Thermal fatigue life

Indexed keywords

CHIP SCALE PACKAGES; CRACK INITIATION; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; LSI CIRCUITS; OPTIMIZATION; RELIABILITY; STRAIN;

EQUIVALENT STRAIN; LEAD PITCHES; LEAD WIDTHS; QUAD FLAT PACKAGE (QPF); THERMAL FATIGUE LIFE;

SOLDERED JOINTS;

EID: 33750579653     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (11)

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