Assessing the performance of crack detection tests for solder joints

Microelectronics Reliability

Volumn 46, Issue 12, 2006, Pages 2122-2130

  Ridout, Stephen ^a   Dusek, Milos ^b   Bailey, Chris ^a   Hunt, Chris ^b  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b NATIONAL PHYSICAL LABORATORY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; FATIGUE OF MATERIALS; NONDESTRUCTIVE EXAMINATION; PRINTED CIRCUIT BOARDS; RESISTORS; STRAIN;

CRACK DETECTION TESTS; MECHANICAL LOADS; STRAIN RESPONSE; SURFACE MOUNT RESISTORS;

SOLDERED JOINTS;

EID: 33749147820     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.05.001     Document Type: Article

References (6)

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3. Andersson C, Andersson D, Tegehall PE, Liu J. Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of real lead free joints of different electronic components. In: Proceedings of the 5th EuroSimE conference, Brussels, Belgium, 2004. p. 455-64.
4. PHYSICA: Software for multi-physics simulations, Greenwich University. Available from: http://physica.gre.ac.uk.
5. Lau J, Chang C, Lee R, Chen TY, Cheng D, Tseng TJ, et al. thermal-fatigue life of solder bumped flip chip on micro via-in-pad (VIP) low cost substrates. In: Proceedings of the NEPCON-West 2000, Anaheim, CA. p. 554-62.
6. Darveaux R., Banerji K., Mawer A., and Dody G. Reliability of plastic ball grid array assembly. In: Lau J. (Ed). Ball grid array technology (1995), Mc-Graw Hill, New York 379-441