Indentation creep behavior of Sn-3.5Ag-2Bi lead-free solder

Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals

Volumn 18, Issue 4, 2008, Pages 620-625

  Zeng, Ming ^a,b   Chen, Zheng Zhou ^b   Shen, Bao Luo ^a   Xu, Dao Fen ^b  

^a SICHUAN UNIVERSITY   (China)

^b XIHUA UNIVERSITY   (China)

Author keywords

Activation energy; Indentation creep; Microstructure; Sn 3.5Ag 2Bi lead free solder; Stress exponent

Indexed keywords

ACTIVATION ENERGY; CONSTITUTIVE EQUATIONS; CREEP; INDENTATION; MICROSTRUCTURE; PLASTIC DEFORMATION; TEMPERATURE;

INDENTATION CREEP; MATERIAL STRUCTURE CONSTANT; SN 3.5AG 2BI LEAD FREE SOLDER; STRESS EXPONENT;

SOLDERING;

EID: 44449120261     PISSN: 10040609     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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