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Volumn 27, Issue 8, 2006, Pages 23-26
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Fracture mechanism of lead-free soldered joints of rectangular chip component
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Author keywords
Rectangular chip component; Shear strength; Sn Ag Cu; Sn Pb
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Indexed keywords
COPPER ALLOYS;
CRACKS;
ELECTRONIC EQUIPMENT;
FRACTURE;
INTERFACES (MATERIALS);
LEAD ALLOYS;
MECHANISMS;
SILVER ALLOYS;
SOLDERED JOINTS;
SOLDERING ALLOYS;
TIN ALLOYS;
LEAD FREE SOLDERED JOINTS;
PLASTIC STRAIN;
RECTANGULAR CHIP COMPONENT;
SOLDER;
SHEAR STRENGTH;
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EID: 33750600890
PISSN: 0253360X
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
Times cited : (1)
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References (12)
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