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Volumn 27, Issue 8, 2006, Pages 23-26

Fracture mechanism of lead-free soldered joints of rectangular chip component

Author keywords

Rectangular chip component; Shear strength; Sn Ag Cu; Sn Pb

Indexed keywords

COPPER ALLOYS; CRACKS; ELECTRONIC EQUIPMENT; FRACTURE; INTERFACES (MATERIALS); LEAD ALLOYS; MECHANISMS; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; TIN ALLOYS;

EID: 33750600890     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (1)

References (12)
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    • Chinese source
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    • Chinese source
  • 4
    • 33750603945 scopus 로고    scopus 로고
    • Chinese source
  • 7
    • 1642324965 scopus 로고    scopus 로고
    • Properties of lead-free solder alloys with rare earth element additions
    • Wu C M L, Yu D Q, Law C M T, et al. Properties of lead-free solder alloys with rare earth element additions[J]. Materials Science and Engineering, 2004, 44(1): 1-44.
    • (2004) Materials Science and Engineering , vol.44 , Issue.1 , pp. 1-44
    • Wu, C.M.L.1    Yu, D.Q.2    Law, C.M.T.3
  • 8
    • 0346216053 scopus 로고    scopus 로고
    • Tensile properties of Sn-Ag based lead-free solders and strain rate sensitivity
    • Shohji I, Yoshida T, Takahashi T, et al. Tensile properties of Sn-Ag based lead-free solders and strain rate sensitivity[J]. Materials Science and Engineering, 2004, 366(1): 50-55.
    • (2004) Materials Science and Engineering , vol.366 , Issue.1 , pp. 50-55
    • Shohji, I.1    Yoshida, T.2    Takahashi, T.3
  • 9
    • 33750603219 scopus 로고    scopus 로고
    • Chinese source
  • 10
    • 33644947263 scopus 로고    scopus 로고
    • Effects of thermal cycling on shear strength of soldered joints of laminar ceramic resistor
    • Xue Songbai, Wang Hui, Hu Yongfang. Effects of thermal cycling on shear strength of soldered joints of laminar ceramic resistor[J]. Transactions of Nonferrous Metals Society of China, 2005, 15(S3): 305-310.
    • (2005) Transactions of Nonferrous Metals Society of China , vol.15 , Issue.S3 , pp. 305-310
    • Xue, S.1    Wang, H.2    Hu, Y.3
  • 11
    • 33750581175 scopus 로고    scopus 로고
    • Chinese source
  • 12
    • 0034297162 scopus 로고    scopus 로고
    • Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
    • Moon K W, Boettinger W J, Katter U R, et al. Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys[J]. Journal of Electronic Materials, 2000, 29(10): 1122-1136.
    • (2000) Journal of Electronic Materials , vol.29 , Issue.10 , pp. 1122-1136
    • Moon, K.W.1    Boettinger, W.J.2    Katter, U.R.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.