Fracture mechanism of lead-free soldered joints of rectangular chip component

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 27, Issue 8, 2006, Pages 23-26

  Xue, Songbai ^a   Han, Zongjie ^a   Wang, Hui ^a   Wang, Jianxin ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Rectangular chip component; Shear strength; Sn Ag Cu; Sn Pb

Indexed keywords

COPPER ALLOYS; CRACKS; ELECTRONIC EQUIPMENT; FRACTURE; INTERFACES (MATERIALS); LEAD ALLOYS; MECHANISMS; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; TIN ALLOYS;

LEAD FREE SOLDERED JOINTS; PLASTIC STRAIN; RECTANGULAR CHIP COMPONENT; SOLDER;

SHEAR STRENGTH;

EID: 33750600890     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

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