Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 18, Issue 4, 2008, Pages 814-818

  HAN, Zong jie ^a   XUE, Song bai ^a   WANG, Jian xin ^a   ZHANG, Xin ^a   ZHANG, Liang ^a   YU, Sheng lin ^a,b   WANG, Hui ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

Author keywords

diode laser soldering; lead free solders; mechanical properties; quad flat package micro joints

Indexed keywords

BRAZING; COPPER; COPPER ALLOYS; EXPERIMENTS; FLIP CHIP DEVICES; FRACTURE FIXATION; LASERS; MECHANICAL PROPERTIES; NICKEL; SILVER; SOLDERING; SOLDERING ALLOYS; TIN; TIN ALLOYS; WELDING;

CONTINUOUS SCANNING; DIODE LASER SOLDERING; DIODE LASERS; EUTECTIC SOLDERING; FRACTURE MORPHOLOGIES; INFRARED REFLOW; IR REFLOW; LASER OUTPUT POWER; LASER SOLDERING; LEAD-FREE SOLDERING; LEAD-FREE SOLDERS; OPTIMAL POWER; QUAD FLAT PACKAGE; QUAD FLAT PACKAGE MICRO-JOINTS; SN-AG-CU;

LEAD;

EID: 48349145303     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1003-6326(08)60141-7     Document Type: Article

References (18)

1. ZHANG W.-d. Practical surface mount technology [M] (2007), Electronics Industry Press, Beijing 69-70 (in Chinese).
2. STAUFFER L., WÜRSCH A., GÄCHTER B., SIERCKS K., VERETTAS I., ROSSOPOULOS S., and CLAVEL R. A surface-mounted device assembly technique for small optics based on laser reflow soldering [J]. Optics and Lasers in Engineering 43 3/5 (2005) 365-372
3. WANG J.-x., XUE S.-b., FANG D.-s., JU J.-l., HAN Z.-j., and YAO L.-h. Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad [J]. Trans Nonferrous Met Soc China 16 6 (2006) 1374-1378
4. SUN P., ANDERSSON C., WEI X.-c., CHENG Z.-n., SHANGGUAN D.-k., and LIU J.-h. Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering [J]. Materials Science and Engineering B 135 2 (2006) 134-140
5. ARULVANAN P., and ZHONG Z.W. Assembly and reliability of PBGA packages on FR-4 PCBs with SnAgCu solder [J]. Microelectronic Engineering 83 11/12 (2006) 2462-2468
6. HAN Z.-j., XUE S.-b., LIU L., WANG J.-x., WU Y.-x., HUANG X., and WANG H. Effects of micro-amount of Ce on microstructures of Sn-Ag-Cu solder and soldered joint [J]. Journal of Rare Earths 24 S (2006) 228-232
7. MCCLUSKEY F.P., DASH M., WANG Z., and HUFF D. Reliability of high temperature solder alternatives [J]. Microelectronics and Reliability 46 9/11 (2006) 1910-1914
8. WU C.M.L., YU D.Q., LAW C.M.T., and WANG L. Properties of lead-free solder alloys with rare earth element additions [J]. Materials Science and Engineering R 44 1 (2004) 1-44
9. GAO F., and TAKEMOTO T. Mechanical properties evolution of Sn-3.5Ag based lead-free solders by nanoindentation [J]. Materials Letters 60 19 (2006) 2315-2318
10. SHOHJI I., YOSHIDA T., TAKAHASHI T., and HIOKI S. Tensile properties of Sn-Ag based lead-free solders and strain rate sensitivity [J]. Materials Science and Engineering A 366 1 (2004) 50-55
11. XUE S.-b., and YU S.-l. Preparation and characterization on micron power solder of Sn-Ag-Cu-RE[J]. Transactions of the China Welding Institution 25 6 (2004) 1-3 (in Chinese).
12. HUANG H.-z., WEI X.-q., and ZHOU L. Progress in the study on the lead-free solder and its reliability [J]. Electronic Components & Materials 22 4 (2003) 39-42 (in Chinese).
13. SUGANUMA K. Lead-free soldering in electronics: Science, technology and environmental impact [M] (2004), Marcel Dekker, New York
14. BOHMAN CF. The laser and microsoldering [R]. AD74-810, Michigan: Society of Manufacturing Engineers, 1974.
15. BANSE H., BECKERT E., EBERHARDT R., STÖCKL W., and VOGEL J. Laser beam soldering-A new assembly technology for microoptical systems [J]. Microsystem Technologies 11 2/3 (2005) 186-193
16. HAN Z.-j., JU J.-l., XUE S.-b., FANG D.-s., WANG J.-x., and YAO L.-h. Microstructures of Sn-Ag-Cu lead-free soldered joints with diode-laser soldering [J]. Journal of Central South University (Science and Technology) 37 2 (2006) 229-234 (in Chinese).
17. ZHONG Q.-p., ZHAO Z.-h., and ZHANG Z. Development of "fractography" and research of fracture micromechanism [J]. Journal of Mechanical Strength 27 3 (2005) 358-370 (in Chinese).
18. ASKELAND D.R., and PHULÉ P.P. The science and engineering of materials (reprint edition) [M] (2005), Tsinghua University Press, Beijing 153-156