Simulation of uniaxial tensile properties for lead-free solders with modified Anand model

Materials and Design

Volumn 30, Issue 1, 2009, Pages 122-128

  Bai, Ning ^a   Chen, Xu ^a   Gao, Hong ^a  

^a TIANJIN UNIVERSITY   (China)

Author keywords

D. Brazing and soldering; E. Mechanical; H. Material property databases

Indexed keywords

ANAND MODEL; INELASTIC DEFORMATIONS; LEAD-FREE SOLDER (SN-3.5AG-0.5CU); MATERIAL PARAMETERS; TRUE STRAIN; VISCO-PLASTIC;

BRAZING; CONSTITUTIVE MODELS; COPPER; COPPER ALLOYS; LEAD; NUMERICAL ANALYSIS; SILVER; TIN; TIN ALLOYS; WELDING;

STRAIN RATE;

EID: 48549095637     PISSN: 02641275     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matdes.2008.04.032     Document Type: Article

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