Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints

Microelectronics Reliability

Volumn 46, Issue 2-4, 2006, Pages 574-588

  Qi, Yan ^a   Lam, Rex ^a   Ghorbani, Hamid R ^a   Snugovsky, Polina ^b   Spelt, Jan K ^a  

^a UNIVERSITY OF TORONTO   (Canada)

^b Celestica Inc   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; FAILURE (MECHANICAL); HEATING; LEAD COMPOUNDS; MICROELECTRONICS; RELIABILITY; TIN COMPOUNDS;

ACCELERATED THERMAL CYCLING; ATC TESTING; FAILURE MECHANISM;

SOLDERED JOINTS;

EID: 30944468155     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.01.008     Document Type: Article

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