Updated life prediction models for solder joints with removal of modeling assumptions and effect of constitutive equations

7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006

Volumn 2006, Issue , 2006, Pages

  Syed, Ahmer ^a  

^a AMKOR TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LIFE PREDICTION MODEL; MESH DENSITY; MULTI-POINT CONSTRAINTS; TEMPERATURE CYCLING;

COMPUTATION THEORY; COMPUTER SIMULATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; THERMAL CYCLING;

SOLDERED JOINTS;

EID: 33847131557     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2006.1644010     Document Type: Conference Paper

References (10)

1. th ECTC2004, pp. 737-746.
2. rd ECTC 2003, pp. 603-610.
3. rd ECTC 2003, pp. 1862-1868.
4. Syed, A., "Factors Affecting Creep-Fatigue Interaction in Eutectic Sn/Pb Solder Joints," Advances in Electronic Packaging 1997, InterPack97, pp. 1535-1542
5. st ECTC 2001, pp. 255-263.
6. Syed, A., "Constitutive Equations and Life Prediction Models for SnPb and SnAgCu Solder Joints," Proceedings IMAPS 2004.
7. rd ECTC 2003, pp. 197-206.
8. rd ECTC 2003, pp. 603-610.
9. Syed, A. R., "ACES of Finite Element and Life Prediction Models for Solder Joint Reliability," Design and Reliability of Solders and Solder Interconnections, TMS Symposium 1997, pp 347 - 355.
10. Morris, J. W., et al, "Creep Properties of Sn-rich Solder Joints," 53rd ECTC 2003, pp. 54-57.