Modified Engelmaier's model taking account of different stress levels

Microelectronics Reliability

Volumn 48, Issue 5, 2008, Pages 773-780

  Salmela, Olli ^a   Andersson, Klas ^b   Perttula, Altti ^b   Särkkä, Jussi ^a   Tammenmaa, Markku ^a  

^a NOKIA SIEMENS NETWORKS   (Finland)

^b NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DUCTILITY; LEAD COMPOUNDS; THERMAL EFFECTS; TIN COMPOUNDS;

FATIGUE DUCTILITY; SOLDER FATIGUE; TEMPERATURE EXCURSIONS;

FATIGUE OF MATERIALS;

EID: 43049165315     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.12.002     Document Type: Article

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