A modified constitutive model for creep of Sn-3.5Ag-0.7Cu solder joints

Journal of Physics D: Applied Physics

Volumn 42, Issue 12, 2009, Pages

  Han, Y D ^a,b   Jing, H Y ^a   Nai, S M L ^c   Tan, C M ^b   Wei, J ^c   Xu, L Y ^a   Zhang, S R ^d  

^a TIANJIN UNIVERSITY   (China)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^d HEBEI NORMAL UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ARRHENIUS; BACK STRESS; CONSTITUTIVE BEHAVIOUR; CREEP BEHAVIOUR; CREEP MECHANISM; CREEP PERFORMANCE; CREEP STRAIN RATE; HIGH STRESS; INTER-METALLIC PARTICLE; LEAD-FREE SOLDER JOINT; LOW STRESS; MATRIX; POWER-LAW CREEP MODEL; SN-3.5AG; SNAGCU SOLDER; SOLDER JOINTS; STRESS EXPONENTS; STRESS REGIME;

CONSTITUTIVE MODELS; CREEP; LEAD; RAILROAD ENGINEERING; SHEAR STRESS; SILVER; SOLDERED JOINTS; STRENGTH OF MATERIALS; TIN;

STRAIN RATE;

EID: 70149121118     PISSN: 00223727     EISSN: 13616463     Source Type: Journal    
DOI: 10.1088/0022-3727/42/12/125411     Document Type: Article

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