Challenges in modification of electronic components

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 2, 2007, Pages 356-358

  Winslow, Russell T ^a  

^a Six Sigma   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AEROSPACE APPLICATIONS; BALL GRID ARRAYS; ELECTRONICS INDUSTRY; MILITARY APPLICATIONS;

AEROSPACE SYSTEM; COLUMN GRID ARRAY (CGA); HOT SOLDER DIP (HSD); MILITARY SYSTEM;

ELECTRONICS PACKAGING;

EID: 34249913170     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.900452     Document Type: Article

References (6)

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3. Y. Fukuda, M. Osterman, and M. Pecht, "The effect of annealing on tin whisker growth," IEEE Trans. Electron. Packag. Manufact., vol. 29, no. 4, pp. 252-258, Oct. 2006.
4. T. Fang, M. Osterman, and M. Pecht, "Statistical Analysis of Tin Whisker Growth," Microelectron. Rel., vol. 46, no. 5-6, pp. 846-849, May/Jun. 2006.
5. S. Sengupta, D. Das, S. Ganesan, and M. Pecht, "Effects of re-finishing of terminations by solder-dipping on plastic quad flatpack electronic parts," in Proc. EPTC Annu. Conf., Singapore, Dec. 2005, pp. 1-6.
6. R. Winslow, G. Iyer, M. Cruz, and G. Selvaduray, "Hot solder dip and minimizing thermal gradients," in Proc. Int. Microelectron. Packag. Soc. Conf., San Diego, CA, Oct. 2006, pp. 513-520.