A study on μBGA solder joints reliability using lead-free solder materials

KSME International Journal

Volumn 16, Issue 7, 2002, Pages 919-926

  Shin, Young Eui ^a   Lee, Jun Hwan ^a   Koh, Young Wook ^a   Lee, Chong Won ^a   Yun, Jun Ho ^b   Jung, Seung Boo ^c  

^a Chung Ang University   (South Korea)

^b Yeojoo Inst of Technol University   (South Korea)

^c Sungkyunkwan University   (South Korea)

Author keywords

Finite Element Method; Intermetallic Compound; Lead Free Solder; Micro Ball Grid Array; Solder Joint; Thermal Fatigue Lif

Indexed keywords

ACTIVATION ENERGY; AGING OF MATERIALS; ENERGY DISPERSIVE SPECTROSCOPY; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FRACTURE; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; STRAIN; THERMAL CYCLING;

THERMAL FATIGUE;

SOLDERED JOINTS;

EID: 0038517680     PISSN: 12264865     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02949720     Document Type: Article

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