Discussion on the reliability issues of solder-bump and direct-solder bonded power device packages having double-sided cooling capability

Journal of Electronic Packaging

Volumn 128, Issue 3, 2006, Pages 208-214

  Bai, John G ^a   Calata, Jesus N ^a   Lu, Guo Quan ^a  

^a Virginia Polytechnic Institute and State University   (United States)

Author keywords

Cooling; Finite element method; Semiconductor device packaging; Soldering

Indexed keywords

COOLING; FINITE ELEMENT METHOD; INTERCONNECTION NETWORKS; SOLDERING; THERMAL EFFECTS; THERMOMECHANICAL TREATMENT;

OPERATING TEMPERATURES; POWER DEVICE PACKAGES; SEMICONDUCTOR DEVICE PACKAGING;

POWER ELECTRONICS;

EID: 33750334783     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2229218     Document Type: Article

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