Thermo-fatigue life prediction methodologies for SnAgCu solder joints in flip-chip assemblies

Jixie Qiangdu/Journal of Mechanical Strength

Volumn 28, Issue 6, 2006, Pages 893-898

  Li, Xiaoyan ^a   Wang, Zhisheng ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Flip chip; Lead free; Life prediction; Solder joint; Thermo fatigue

Indexed keywords

EID: 33846363599     PISSN: 10019669     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (34)