Creep-fatigue life evaluation for Sn-3.5Ag solder

Journal of Engineering Materials and Technology

Volumn 128, Issue 2, 2006, Pages 142-150

  Nozaki, Mineo ^a   Sakane, Masao ^b   Tsukada, Yutaka ^c   Nishimura, Hideo ^d  

^a HYOGO PREFECTURAL INSTITUTE OF TECHNOLOGY   (Japan)

^b RITSUMEIKAN UNIVERSITY   (Japan)

^c KYOCERA CORPORATION   (Japan)

^d IBM JAPAN LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; FATIGUE OF MATERIALS; GRAIN BOUNDARIES; LOADS (FORCES); MATHEMATICAL MODELS; STRAIN;

CREEP-FATIGUE DAMAGE RULES; GRAIN BOUNDARY SLIDING MODEL; LINEAR DAMAGE RULE; STRAIN WAVES;

SOLDERING ALLOYS;

EID: 33645971281     PISSN: 00944289     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2172273     Document Type: Article

References (22)

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