Lead free solder joint reliability characterization for PBGA, PQFP and TSSOP assemblies

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 916-921

  Che, F X ^a   Pang, John H L ^a   Xiong, B S ^a   Xu, Luhua ^a   Low, T H ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC ASSEMBLIES; FAILURE MODES; SURFACE FINISHING;

FATIGUE OF MATERIALS; FINISHING; FINITE ELEMENT METHOD; RELIABILITY; THERMAL EFFECTS;

SOLDERED JOINTS;

EID: 24644487869     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

1. JEDEC Standard, JESD22-A104B, Temperature Cycling, July 2000.
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3. Tunga, K., Kacher, K., Pucha, R.V., and Sitaraman, S.K., "Accelerated Thermal Cycling: Is It Different for Lead-free solder?", 54th ECTC, June 1-4, 2004, Las Vegas, Nevada, pp. 1579-1585.
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10. Che, F.X., and Pang, H.L.J., "Thermal Fatigue Reliability Analysis for PBGA with Sn-3.8Ag-0.7Cu Solder Joints", 6th EPTC, December 8-10, 2004, Pan Pacific Hotel, Singapore.pp.787-792.
11. Pang, H.L.J., Low, T.H., Xiong, B.S. and Che, F.X., "Design For Reliability (DFR) Methodology For Electronic Packaging Assemblies", 5th EPTC, December 10-12, 2003, Singapore, pp. 470-478.
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13. Pang, H.L.J., Xiong, B.S. and Che, F.X., "Modeling Stress Strain Curves For Lead-Free 95.5Sn-3.8Ag-0.7Cu Solder", Eurosim 2004, May 9-12, 2004, Brussels, Belgium, pp. 449-453.
14. Pang, H.L.J., Low, T.H, and Xiong, B.S, "Lead-Free 95.5Sn-3.8Ag-0.7Cu Solder Joint Reliability Analysis For Micro-BGA Assembly", InterTherm 2004, Las Vegas, June 1-4, 2004, pp.131-136.