Ceramic column grid array technology with coated solder columns

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1347-1353

  Hong, Bor Zen ^a   Ray, Sudipta K ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; SOLDERING; VISCOPLASTICITY;

CERAMIC BALL GRID ARRAY; CERAMIC COLUMN GRID ARRAY; COATED SOLDER COLUMNS;

ELECTRONICS PACKAGING;

EID: 0034479230     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)