Flip chip solder joint reliability analysis using viscoplastic and elastic-plastic-creep constitutive models

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 2, 2006, Pages 355-363

  Yeo, Alfred ^a   Lee, Charles ^a   Pang, John H L ^b  

^a INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Finite element analysis (FEA); First time to failure (FTTF); Thermal cycling (TC)

Indexed keywords

CREEP; DEFORMATION; ELASTOPLASTICITY; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MATHEMATICAL MODELS; RELIABILITY; THERMAL CYCLING; VISCOPLASTICITY;

ELASTIC-PLASTIC-CREEP CONSTITUTIVE MODELS; FIRST-TIME-TO-FAILURE; INELASTIC DEFORMATION ANALYSIS; THERMAL CYCLIC LOADING;

SOLDERED JOINTS;

EID: 33744783713     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.875893     Document Type: Article

References (20)

1. J. H. Lau and Y.-H. Pao, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies. New York: McGraw-Hall, 1997.
2. C. E. Hanna and S. K. Sitaraman, "Role of underfill materials and thermal cycling on die stresses," Adv. Electron. Packag., ASME, vol. EEP-26-1, pp. 795-801, 1999.
3. C. E. Hanna et al., "Numerical and experimental study of the evolution of stresses in flip chip assemblies during assembly and thermal cycling," in Proc. 49th Electron. Comp. Technol. Conf., Las Vegas, NV, Jun. 1999, pp. 1001-1009.
4. J. H. Okura et al., "Guidelines to select underfills for flip chip on board assemblies," in Proc. 49th Electron. Comp. Technol. Conf., Las Vegas, NV, May 1999, pp. 1173-1180.
5. H. L. J. Pang, Y. R. Chong, and S. K. Sitaraman, "FEA modeling of FCOB assembly warpage and stresses due to underfill encapsulation and thermal cycling loading," in Proc. ASME Adv. Electron. Packag. (Inter-PACK'99), vol. EEP-26-1, Jun. 1999, pp. 803-807.
6. H. L. J. Pang, C. W. Seetoh, and Z. P. Wong, "CBGA solder joint reliability evaluation based on elastic-plastic-creep analysis," ASME J. Electron. Packag., vol. 122, pp. 255-261, Sep. 2000.
7. D. G. Yang et al., "Combined experimental and numerical investigation on flip chip solder fatigue with cure-dependent underfill properties," in Proc. 51st Electron. Comp. Technol. Conf., Las Vegas, NV, May 2001, pp. 388-388.
8. B. Vandevelde et al., "Solder parameter sensitivity for csp life-time prediction using simulation-based optimization method," IEEE Trans. Electron. Packag. Manufact., vol. 25, no. 4, pp. 318-325, Oct. 2002.
9. Z. Qian et al., "Fatigue life prediction of flip chips in terms of non-linear behaviors of solder and underfill," in Proc. 49th Electron. Comp. Technol. Conf., Las Vegas, NV, May 1999, pp. 141-148.
10. A. Syed, "Predicting solder joint reliability for thermal, power & bend cycle within 25% accuracy," in Proc. 51st Electron. Comp. Technol. Conf., Las Vegas, NV, May 2001, pp. 255-264.
11. X. Q. Shi, Q. J. Yang, Z. P. Wang, H. L. J. Pang, and W. Zhou, "Reliability assessment of PBGA solder joints using the new creep constitutive relationship and modified energy-based life prediction model," in Proc. 3rd EPTC, Singapore, Dec. 2000, pp. 398-405.
12. ANSYS Release 7.0-Theory Reference, ANSYS, Inc., Singapore, 2002.
13. G. Z. Wang, Z. N. Cheng, K. Becker, and J. Wilde, "Applying anand model to represent the viscoplastic deformation behavior of solder alloys," J. Electron. Packag., Trans. ASME, vol. 123, pp. 247-253, Sep. 2001.
14. L. Chen, Q. Zhang, G. Wang, X. Xie, and Z. Cheng, "The effects of underfill and its material models on thermomechanical behaviors of a flip chip package," IEEE Trans. Adv. Packag., vol. 24, no. 1, pp. 17-24, Feb. 2001.
15. T. Alander, P. Heino, and E. Ristolainen, "Solder bump reliability - Issues on bump layout," IEEE Trans. Adv. Packag., vol. 23, no. 3, pp. 715-720, Nov. 2000.
16. R. Darveaux, "Effect of simulation methodology on solder joint crack growth correlation," in Proc. 50th Electron. Comp. Technol. Conf., Las Vegas, NV, May 2000, pp. 1048-1063.
17. R. Darveaux, "Effect of simulation methodology on solder joint crack growth correlation and fatigue life prediction," J. Electron. Packag., Trans. ASME, vol. 124, pp. 147-154, Sep. 2002.
18. R. Darveaux and K. Banerji, "Constitutive relations for tin-based solder joints," IEEE Trans. Compon., Hybrids, Manufact. Technol., vol. 15, no. 6, pp. 1013-1024, Dec. 1992.
19. X. Q. Shi, Z. P. Wang, H. L. J. Pang, and W. Zhou, "Effect of temperature and strain rate on mechanical properties of 63Sn/37Pb solder alloy," J. Electron. Packag., Trans. ASME, vol. 121, pp. 179-185, Sep. 1999.
20. X. Q. Shi, Z. P. Wang, H. L. J. Pang, and W. Zhou, "A modified energy-based low cycle fatigue model for eutectic solder alloy," Scripta Materi., vol. 114, no. 2, 1999.