Fatigue life prediction of SnAgCu soldered joints of FCBGA device

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 29, Issue 7, 2008, Pages 85-88

  Zhang, Liang ^a   Xue, Songbai ^a   Han, Zongjie ^a   Lu, Fangyan ^a   Yu, Shenglin ^a,b   Lai, Zhongmin ^a,c  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

^c JIANGSU UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Constistutive equation; Fatigue life; Underfill

Indexed keywords

COPPER; FATIGUE OF MATERIALS; SOLDERED JOINTS; STRESS CONCENTRATION;

ANAND MODEL; APPLICATIONS.; CONSTISTUTIVE EQUATION; FATIGUE LIFE; FATIGUE LIFE PREDICTIONS; STRESS CONCENTRATES; STRESS DISTRIBUTIONS; TOP SURFACE; UNDERFILL; UNDERFILL PROPERTIES; YOUNG'S MODULUS;

BRAZING;

EID: 50049117285     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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