Thermo-fatigue life evaluation of SnAgCu solder joints in flip chip assemblies

Journal of Materials Processing Technology

Volumn 183, Issue 1, 2007, Pages 6-12

  Li, Xiaoyan ^a   Wang, Zhisheng ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Fatigue; Flip chip; Lead free; Solder joint

Indexed keywords

DEFORMATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; STRAIN; THERMAL STRESS;

FLIP CHIP ASSEMBLIES; LEAD FREE SOLDER JOINTS; STRAIN ENERGY DENSITY; THERMAL FATIGUE;

SOLDERED JOINTS;

EID: 33846603220     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2006.09.010     Document Type: Article

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