A study into the sequencing of thermal cycling and vibration tests

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 584-592

  Perkins, Andy ^a   Sitaraman, Suresh K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LOADING CONDITIONS; MICRO-ELECTRONIC PACKAGING; SOLDER JOINT RELIABILITY;

AUTOMOBILE PARTS AND EQUIPMENT; BRAZING; COMPUTER NETWORKS; LATTICE VIBRATIONS; MICROELECTRONICS; MILITARY APPLICATIONS; RELIABILITY; STEEL STRUCTURES; THEOREM PROVING; VIBRATIONS (MECHANICAL); WELDING;

LOADING;

EID: 51349138939     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550032     Document Type: Conference Paper

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