Characterization of lead-free solders in flip chip joints

Journal of Electronic Packaging

Volumn 125, Issue 4, 2003, Pages 531-538

  Wiese, S ^a   Meusel, E ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; CREEP TESTING; FLIP CHIP DEVICES; MICROSTRUCTURE; SOLDERING; SURFACE MOUNT TECHNOLOGY;

FLIP CHIP SOLDER JOINTS; MICROSTRUCTURAL ANALYSIS;

ELECTRONICS PACKAGING;

EID: 0346936438     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1604155     Document Type: Article

References (20)

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