Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders

Journal of Electronic Materials

Volumn 26, Issue 7, 1997, Pages 783-790

  Mavoori, H ^a   Chin, J ^a   Vaynman, S ^a   Moran, B ^a   Keer, L ^a   Fine, M ^a  

^a NORTHWESTERN UNIVERSITY   (United States)

Author keywords

Constitutive modeling; Creep; Sn Ag eutectic; Sn Zn eutectic; Solders; Stress relaxation

Indexed keywords

ACTIVATION ENERGY; CREEP TESTING; EUTECTICS; LEAD; MATHEMATICAL MODELS; PLASTIC DEFORMATION; PLASTICITY; RELIABILITY; STRAIN RATE; STRESS RELAXATION; TENSILE TESTING; TIN ALLOYS;

CREEP PLASTICITY THEORY; SOLDER INTERCONNECTS;

SOLDERING ALLOYS;

EID: 0031192444     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-997-0252-z     Document Type: Article

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