Prediction of stress-strain relationship with an improved anand constitutive model for lead-free solder Sn-3.5Ag

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 1, 2005, Pages 111-116

  Chen, Xu ^a   Chen, Gang ^a   Sakane, Masao ^b  

^a TIANJIN UNIVERSITY   (China)

^b RITSUMEIKAN UNIVERSITY   (Japan)

Author keywords

Anand model; Constitutive model; Lead free solder; Sn 3.5Ag

Indexed keywords

COMPUTER SIMULATION; DEFORMATION; MATHEMATICAL MODELS; SOLDERING ALLOYS; STRAIN; STRAIN RATE; STRESSES; THERMAL EFFECTS; TIN ALLOYS;

ANAND MODEL; CONSTITUTIVE MODEL; LEAD FREE SOLDER;

ELECTRONICS PACKAGING;

EID: 15744364427     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.843157     Document Type: Article

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