Effects of ramp-time on the thermal-fatigue life of SnAgCu lead-free solder joints

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1292-1298

  Lau, John ^a   Dauksher, Walter ^a  

^a AGILENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP RESPONSES; CYCLING TEMPERATURES; LEAD-FREE SOLDER JOINTS; PLASTIC BALL GRID ARRAY (PBGA);

CREEP; FATIGUE OF MATERIALS; LEAD ALLOYS; PRINTED CIRCUIT BOARDS; THERMAL CYCLING; TIN ALLOYS;

SOLDERED JOINTS;

EID: 24644490298     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. Lau, J. H., Low-Cost Flip Chip for DCA, WLCSP, and PBGA Assemblies, McGraw-Hill, New York, NY, 2001.
2. Lau, J. H., C. P. Wong, N. C. Lee, and R. Lee, Electronics Manufacturing with Lead-Free, Halogen-Free & Conductive-Adhesive Materials, McGraw-Hill, New York, NY, 2003.
3. Schubert, A., R. Dudek, E. Auerswald, A. Gollhardt, B. Michel, and H. Reichl, "Fatigue Life Models for SnAgCu and SnPb Solder Joints Evaluated by Experiments and Simulation," IEEE Electronic Components and Technology Conference Proceedings, New Orleans, Louisiana, June 2003, pp. 603-610.
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7. Lau, J. H., and W. Dauksher, "Creep of Sn-(3.5-3.9)wt%Ag-(0.5-0.8) wt%Cu Lead-Free Solder", in Micromaterials and Nanomaterials, Edited by B. Michel, Fraunhofer Institute, IZM, Berlin, 2004, pp. 54-62.
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9. Lau, J. H., D. Shangguan, D. Lau, T. Kung, and R. Lee, "Thermal-Fatigue Life Prediction Equation for Wafer-Level Chip Scale Package (WLCSP) Lead-Free Solder Joints on Lead-Free Printed Circuit Board (PCB)", Proceedings of IEEE Electronic Components and Technology Conferences, Las Vegas, May 2004, pp. 1563-1569.
10. Song, H. J., J. W. Morris, and F. Hua, "The Creep Properties of Lead-Free Solder Joints," Journal of Materials, June 2002, pp. 30-32.
11. Lau, J. H., R. Lee, and D. Shangguan, "Thermal Fatigue-Life Prediction of Lead-Free Solder Joints", ASME Paper No. IMECE2004-62493, Anaheim, CA, November 2004.
12. Lau, J. H., and W. Dauksher, "Effects of Dwell-Time on the Thermal-Fatigue Life of SnAgCu Lead-Free Solder Joints", ASME Paper No. IMECE2004-62492, Anaheim, CA, November 2004.
13. ANSYS, User's Manual, Release 6, 2003.