A testing method for assessing solder joint reliability of FCBGA packages

Microelectronics Reliability

Volumn 44, Issue 5, 2004, Pages 833-840

  Wang, Jinlin ^a   Lim, H K ^b   Lew, H S ^b   Saw, Woon Theng ^b   Tan, Chew Hong ^b  

^a INTEL CORPORATION   (United States)

^b Intel Technology Malaysia Sdn Bhd   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

CORRELATION METHODS; ELECTRONIC EQUIPMENT TESTING; EVALUATION; INTERFACES (MATERIALS); INTERMETALLICS; OXIDATION; PRINTED CIRCUIT BOARDS; RELIABILITY; STRENGTH OF MATERIALS;

BALL SHEAR TEST; SOLDER JOINT STRENGTH;

SOLDERED JOINTS;

EID: 1842864305     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2003.10.009     Document Type: Article

References (9)

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