Effect of high-speed loading conditions on the fracture mode of the BGA solder joint

Microelectronics Reliability

Volumn 48, Issue 11-12, 2008, Pages 1882-1889

  Kim, Jong Woong ^a   Jang, Jin Kyu ^a   Ha, Sang Ok ^a   Ha, Sang Su ^a   Kim, Dae Gon ^b   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; COPPER; ELECTRIC CURRENTS; FRACTURE; LEAD; SINGLE CRYSTALS; SOLDERING; SOLDERING ALLOYS; STRAIN RATE; TESTING; TIN; WELDING;

BALL GRID ARRAY PACKAGES; BALL SHEARS; BGA SOLDER JOINTS; BRITTLE INTERFACIAL FRACTURES; COMPUTATIONAL SIMULATIONS; FRACTURE MODES; HIGH SHEARS; HIGH STANDARDS; HIGH STRAINS; LINEAR FINITE ELEMENTS; LOADING CONDITIONS; RATE SENSITIVITIES; SHEAR FORCES; SHEAR HEIGHTS; SHEAR SPEEDS; SHEAR TESTS; SOLDER ALLOYS; SOLDER BALLS; SOLDER JOINTS; SOLDER MATERIALS; STRENGTHENING MECHANISMS; TEST PARAMETERS; TEST RESULTS;

SPEED;

EID: 55849153525     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.07.066     Document Type: Article

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