Shorter field life in power cycling for organic packages

Journal of Electronic Packaging

Volumn 129, Issue 1, 2007, Pages 28-34

  Park, S B ^a   Ahmed, Izhar Z ^a  

^a State University of New York   (United States)

Author keywords

ANSYS; ATC; CFD; FEA; Flip chip PBGA; ICEPAK; Power cycling

Indexed keywords

BALL GRID ARRAYS; COMPUTATIONAL FLUID DYNAMICS; DIES; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; HEAT TRANSFER; STRAIN ENERGY; TEMPERATURE DISTRIBUTION; THERMAL EXPANSION;

CERAMIC PACKAGES; DIE EDGE; FIELD LIFE; PLASTIC PACKAGES; POWER CYCLING;

ELECTRONICS PACKAGING;

EID: 38749130065     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2429706     Document Type: Article

References (8)

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2. Darveaux, R., and Mawer, A., 1995, "Thermal and Power Cycling Limits of Plastic Ball Grid Array (PBGA) Assemblies," Proceedings Surface Mount International, SMTA., Sun Jose, CA, August 28-31, pp. 315-326.
3. Vcrma, K., Park, S. B., Han. B., and Ackerman, W., 2001, "On the Design Parameters of Flip Chip PBGA Package Assembly for Optimum Solder Ball Reliability," IEEE Trans. Compon. Packag. Technol., 24(2), pp. 300-307.
4. Towashirapornl, P., Subbarayan1 G., Mcllvanie, B., Hunter, B. C., Love, D., and Sullivan, B., 2002. "Predictive Reliability Models through Validated Correlation between Power Cycling and Thermal Cycling Accelerated Life Tests," Soldering Surf, Mount Technol., 14(3), pp. 51-60.
5. Rodgers, B., Punch, J., Jarvis. J., Myllykoski, P., and Rienikainen, T., 2002, "Finite Element Modeling of a BGA Package Subjected to Thermal and Power Cycling," Proceedings Inter Society Conference on Thermal Phenomena, San Diego, CA. May 29-June 1, pp. 993-1000.
6. ICEPAK 3.2 is a trademark of FLUENT, Inc., ICEPAK 3.2 Users Manual.
7. ANSYS 7.1 is a trademark of ANSYS, Inc., ANSYS 7.1 Users Manual.
8. Darveaux, R., 2000, "Effect of Simulation Methodology on Solder Joint Crack Growth Correlation," Proceedings of 50th ECTC. Las Vegas, NV, May 21-24, pp. 1048-1058.