Effect of underfill thermomechanical properties on thermal cycling fatigue reliability of flip-chip ball grid array

Journal of Electronic Packaging

Volumn 126, Issue 4, 2004, Pages 560-564

  Wang, Tong Hong ^a   Lai, Yi Shao ^a   Wu, Jenq Dah ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; ELASTIC MODULI; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; GLASS TRANSITION; INTERCONNECTION NETWORKS; THERMAL CYCLING; THERMOANALYSIS; THERMOMECHANICAL TREATMENT;

FATIGUE RELIABILITY; FLIP-CHIP BALL; GRID ARRAYS; SOLDER BUMBS;

FLIP CHIP DEVICES;

EID: 13944261675     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1827271     Document Type: Article

References (10)

1. Popelar, S., and Roesch, M., 2000, "Flip Chip Reliability Modeling Based on Solder Fatigue as Applied to Flip Chip on Laminate Assemblies," Int. J. Microcircuits Electron. Packag., 23(4), pp. 462-468.
2. Zahn, B. A., 2000, "Comprehensive Solder Fatigue and Thermal Characterization of a Silicon Based Multi-Chip Module Package Utilizing Finite Element Analysis Methodologies," Proc. 9th International ANSYS Conference Exhibit, 9th International ANSYS Conference and Exhibitions, Pittsburgh, PA, USA.
3. Wiese, S., Schubert, A., Walter, H., Dudek, R., Feustel, F., Meusel, E., and Michel, B., 2001, "Constitutive Behaviour of Lead-Free Solders vs. Lead-Containing Solders Experiments on Bulk Specimens and Flip-Chip Joints," Proc. 51st Electr. Comp. Technol. Conference, 51st Electronic Components and Technology Conference, Lake Buena Vista, CA, USA, pp. 890-902.
4. Darveaux, R., 2002, "Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction," J. Electron. Packag., 124(3), pp. 147-154.
5. Lau, J. H., Lee, S. W. R., Pan, S. H., and Chang, C., 2002, "Nonlinear-Time-Dependent Analysis of Micro Via-in-Pad Substrates for Solder Bumped Flip Chip Applications," J. Electron. Packag., 124, pp. 205-211.
6. Schubert, A., Dudek, R., Walter, H., Jung, E., Gollhardt, A., Michel, B., and Reichl, H., 2002, "Reliability Assessment of Flip-Chip Assemblies With Lead-Free Solder Joints," Proc. 52nd Electr. Comp. Technol. Conference, 52nd Electronic Components and Technology Conference, San Diego, CA, USA.
7. Dutta, I., Gopinath, A., and Marshall, C., 2002, "Underfill Constraint Effects During Thermo-Mechanical Cycling of Flip Chip Solder Joints," J. Electron. Mater., 31(4), pp. 253-264.
8. Schubert, A., Dudek, R., Auerswald, E., Gollhardt, A., Michel, B., and Reichl, H., 2003, "Fatigue Life Models for SnAgCu and SnPb Solder Joints Evaluated by Experiments and Simulation," Proc. 53rd Electr. Comp. Technol. Conference, 53rd Electronic Components and Technology Conference, New Orleans, LA, USA, pp. 603-610.
9. Chiang, K.-N., and Yuan, C.-A., 2001, "An Overview of Solder Bump Shape Prediction Algorithms With Validations," IEEE Transactions on Advanced Packaging 24(2), pp. 158-162.
10. Skrzypek, J. J., 1993, Plasticity and Creep, CRC press, Boca Raton.