Finite element analysis on soldered joint reliability of QFP device with different lead materials

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 28, Issue 6, 2007, Pages 65-68

  Zhang, Liang ^a   Xue, Songbai ^a   Lu, Fangyan ^a   Han, Zongjie ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Finite element method; Lead material; Residual stress; Strain and stress

Indexed keywords

FINITE ELEMENT ANALYSIS; LEAD MATERIAL;

COPPER ALLOYS; FINITE ELEMENT METHOD; RESIDUAL STRESSES; STRESS CONCENTRATION;

SOLDERED JOINTS;

EID: 34447301491     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (13)