Constitutive models of creep for lead-free solders

Journal of Materials Science

Volumn 44, Issue 14, 2009, Pages 3841-3851

  Ma, Hongtao ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONSTITUTIVE MODELING; CREEP DEFORMATIONS; CREEP FAILURE; CREEP MECHANISM; ELECTRONIC PACKAGE; EXPERIMENTAL DATA; FINITE ELEMENT ANALYSIS; GRAIN-BOUNDARY DIFFUSION; HIGH STRESS; HIGH-TEMPERATURES; INTERMETALLIC COMPOUNDS; LATTICE DIFFUSION; LEAD FREE SOLDERS; LEAD-FREE; LOW STRESS; MODELING STUDIES; ROOM TEMPERATURE; SECOND PHASE; SN-PB EUTECTIC SOLDER; SNPB SOLDER; SOLDER JOINTS; STRESS LEVELS; TESTING TEMPERATURE;

ACTIVATION ENERGY; BRAZING; CONSTITUTIVE MODELS; CREEP; CREEP TESTING; EUTECTICS; FAILURE ANALYSIS; GRAIN BOUNDARIES; GRAIN BOUNDARY SLIDING; GRAIN SIZE AND SHAPE; LEAD; LEAD ALLOYS; QUALITY ASSURANCE; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING ALLOYS; TIN; WELDING;

CREEP RESISTANCE;

EID: 67649408774     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-009-3521-9     Document Type: Article

References (30)

1. Garofalo F (1966) Fundamentals of creep and creep-rupture in metals. The Macmillan Company, USA
2. Hertzberg RW (1996) Deformation and fracture mechanics of engineering materials, 4th edn. John Wiley & Sons Inc, NY
3. Evans RW, Wilshire B (1985) Creep of metals and alloys. The Institute of Metals, London
4. AK Mukherjee JE Bird JE Dorn 1969 Trans Am Soc Met 62 155
5. Clech JP. Review and analysis of lead-free materials properties, NIST, Available at: http://www.metallurgy.nist.gov/solder/clech/Sn-Ag-Cu-Main.htm
6. Ma H, Suhling JC, Lall P, Bozack M (2006) Reliability of the aging lead-free solder joints. In: Proceeding of the 56th electronic components and technology conference (ECTC), San Diego, California, May 30-June 2, 2006, pp 849-864 (Pubitemid 44929781)
7. Ma H, Suhling JC, Lall P, Bozack M (2007) The influence of elevated temperature aging on reliability of lead-free solder joints. In: The proceeding of the 57th electronic components and technology conference (ECTC), May 2007, pp 653-668
8. D Mitlin CH Raeder RW Messler 1999 Metall Mater Trans A 30 115
9. CH Raeder D Mitlin RW Messler 1998 J Mater Sci 33 18 4503 10.1023/A:1004439931547
10. Alaa Farag Abd El-Rehim 2008 J Mater Sci 43 4 1444 10.1007/s10853-007- 2312-4
11. F Cheng H Nishikawa T Takemoto 2008 J Mater Sci 43 10 3643 10.1007/s10853-008-2580-7
12. Lau JH, Pang JHL, Ning-Cheng Lee, Luhua Xu (2007) Material properties and intermetallic compounds of Sn 3 wt% Ag 0.5 wt% Cu 0.019 wt% Ce (SACC). In: The proceedings of 57th electronic components and technology conference (ECTC07), pp 211-218 (Pubitemid 47577033)
13. Tan KE, Xu L, Pang JHL (2008) Creep properties of Sn3 wt%AgO.5 wt%CuO.Ol9 wt%Ce (SACC) lead-free solder. In: The proceeding of 58th electronics packaging technology conference (ECTC08), pp 521-526
14. Dorn JE (1957) Creep and recovery. ASM Publication, Metal Park, OH, p 255
15. J Weertman 1968 ASM Trans Q 61 681
16. PL Hanke AF Sprecher H Conrad 1997 J Elec Materi 26 774
17. Schubert A, Walter H, Dudek R, Michel B, Lefranc G, Otto J, Mitic G (2001) Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders. In: International symposium on advanced packaging materials, pp 129-134 (Pubitemid 32457048)
18. D Grivas KL Murty J Morris w Jr 1979 Acta Metall 27 731
19. I Dutta C Park S Choi 2004 Mater Sci Eng A 379 40 1
20. R Darveaux K Banerji 1992 IEEE Trans Compon Hybrids Manuf Technol 15 6 1013
21. Q Xiao WD Armstrong 2005 J Elec Materi 34 2 196
22. Wiese S, Schubert A, Walter H, Dudek R, Feustel F, Meusel E, Michel B. Constitutive behavior of lead-free solders vs. lead-containing solders-experiments on bulk specimens and flip-chip joints. In: Proceeding of the 51st electronic components and technology conference, pp 890-902 (Pubitemid 32883495)
23. XQ Shi ZP Wang QJ Yang HLJ Pang 2003 J Eng Mater Technol 125 81
24. Zhang Q, Dasgupta A, Haswell P (2003) Viscoplastic constitutive properties and energy-partitioning model of lead-free Sn3.9Ag0.6Cu solder alloy. In: Proceeding of the 53rd electronic components and technology conference, pp 1862-1868
25. Darveaux R, Banerji K, Dody G (1995) Reliability of plastic ball grid array assembly. In: Lau JL (ed) Ball grid array technology. McGraw-Hill, New York, p 379
26. Vianco PT (2006) In: Shangguan D (ed) Fatigue and creep of lead-free solder alloys: fundamental properties. ASM International, pp 67-106
27. Lau J, Dauksher W, Vianco P (2003) Acceleration models constitutive equations reliability of lead-free solders and joints. In: Proceeding of the 53rd electronic components and technology conference, pp 229-236
28. Vianco PT, Rejent JA (2002) Compression deformation response of 95.5Sn-3.9Ag-0.6Cu Solder. UCLA Workshop on Pb-free Electronics. Available at: http://www.seas.ucla.edu/eThinFilm/PbfreeWorkshop/pdf/vianco.pdf
29. Pang JHL, Xiong BS, Low TH (2004) Creep and fatigue characterization of lead-free 95.5Sn-3.8Ag-0.7Cu solder. In: Proceeding of 54th electronic components and technology conference, pp 1333-1337
30. Schubert A, Dudek R, Auerswald E, Gollbardt A, Michel B, Reichl H (2003) Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation. In: Proceeding of the 53rd electronic components and technology conference, pp 603-610