Constitutive relations of indium solder joint in cold temperature electronic packaging based on Anand model

2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM

Volumn , Issue , 2008, Pages 683-686

  Wu, Rui ^a   McCluskey, F Patrick ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; CONSTITUTIVE MODELS; DEFORMATION; ELECTRONICS ENGINEERING; ELECTRONICS PACKAGING; FIGHTER AIRCRAFT; FORMING; NUMERICAL ANALYSIS; THERMOMECHANICAL TREATMENT; WELDING;

ANAND MODEL; LOW TEMPERATURE;

INDIUM;

EID: 51149115957     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2008.4544334     Document Type: Conference Paper

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